Package Inspector

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Dicing saws, Ball, Bump, Burr AOI

Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

Systems for nondestructive inspection of bonded wafers and packaged semiconductor

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Semiconductor, LED, PV inspection, testing and sorting solutions. Advance robotic solutions.

IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.

AOI for Back- End Semiconductor: Vision Inspection System, Post Seal Vision Handler, Tray-based Vision Handler, Wafer Vision Inspection Handler

AOI (Automatic Optical Inspection) equipment for FPD and semiconductor products.

Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems

Wafer, Reticle and Package Inspection Systems. Lasrer Marking Systems. Auto Scope System.

Semiconductor assembly & test industry with standalone or integrated package handling, electrical test, inspection, tape & reel etc using our own proprietary technologies

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Vison Inspection System, Wafer Measurement System, Wafer Handling System

Hi-End Probe Card PCB, Package test Load Board PCB Micro-Pitch extend solution ( MVP, MLO ) Probe card test Worx, PRVX, PB Mother Board Interface kit for ATE. Semiconductor test service for Analog IC, Digital IC, Hi-Power IC, Mixed IC

Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.

Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.