Cleaning equipment
Cleaner
Our wafer cleaning equipment is a product that achieves the highest level of cleaning capacity designed based on the know-how gained from our wafer processing process.
We are developing and manufacturing process equipment that combines chemical cleaning of acids and alkalis, ozone water using chemically active species as a countermeasure for earth-friendly waste liquid treatment, and other dry and wet cleaning.
KC-150 / 200/300
K series
Evolving next-generation wet process equipment
Our standard model has a lineup of cleaning, coating, developing, etching, peeling and all wet processes.
WSC-WA200
RCA 2 chamber
Small RCA cleaning device that can use both acid and alkali
SPM and DHF can be used in the acid chamber, and APM can be used in the alkaline chamber.
WSC-TA200
RCA 3 chamber
Single-wafer full RCA cleaning
This is our flagship model that can perform precision cleaning for various purposes such as removing metal ions, particles, and oxide film.
WS-200
Cleaning equipment for through silicon vias
Can be treated with chemicals in a reduced pressure environment.
WSC-A300F
300 mm model
FOUP / FOSB compatible model
It can be manufactured according to cleaning applications such as backside bevel cleaning and RCA cleaning.
WSCR-A200E
Dry & wet
Dry & Wet Fusion Process Cleaning
The combination of dry cleaning and wet cleaning effectively cleans.
WSC-A200WR
With underwater loader
Standard process for cleaning after polishing
The ground and polished wafers are stored underwater during standby to prevent slurries and other sticking.
WSC-WA150 NM1S
Double-sided scrub
Vertical double-sided compact scrubber using centrifugal force + gravity
The vertical scrub structure efficiently removes particles.
MSC-200S
Mask cleaning with reversal
The definitive edition of working mask cleaning
Resist is easily removed by sulfuric acid hydrogen peroxide, and both sides can be washed automatically.
MSC-700
Large cleaning
□ Square substrate cleaning machine that can handle up to 700 mm
It can be equipped with sulfuric acid hydrogen peroxide, ammonia hydrogen peroxide, and other physical cleaning functions.
WSC-AW200
Multi-stage type
Cleaning device with chemical recycling function using a multi-stage chamber
The upper and lower two-stage chamber structure separates the chemical solution and rinse drainage, enabling circulation and recycling of the chemical solution.
SCU150 / 300
Vertical double-sided simultaneous
compact scrubber
Supports a wide variety of workpieces such as Si wafers and glass wafers.
LC-150 / 300
Labospin
Multipurpose spinner for R & D
A chemical-compatible spinner that narrows down the required functions and realizes a significant cost reduction.
Coating device
Coating
We have a lineup from R & D applications to production applications and models compatible with large substrates. Adopting a dispensing mechanism specialized for small quantities and many types, materials can be easily replaced. The automatic transfer model can be combined with baking units, cool plates, coater pretreatment (wet / dry) cleaning equipment and developing equipment.
KRC-150 / 200/300
K series
Evolving next-generation wet process equipment
Our standard model has a lineup of cleaning, coating, developing, etching, peeling and all wet processes.
WRCD-A200
Coater developer
All-in-one model for coaters and developers
HMDS, coating, pre-baking, developing, and post-baking can all be done with this one unit.
WRC-700
Large coater
□ Square substrate coating device that can handle up to 700 mm
The rotating cup structure allows fringe-free resist application to square substrates.
WSCR-A200E
Dry & wet
Resist coating device with surface modification function
Improves resist coating performance by pre-coating cleaning and surface modification with excimer UV.
WRC-200BC
Back side coater
Apply resist without touching the pattern surface
Since the protective resist is applied to the back surface of the wafer, it is handled and coated on the pattern surface without contact.
Developer
Developing
We have a lineup from small diameter size for spray development and paddle development (organic / alkaline compatible) to large equipment for □ 700 mm.
Wafer / mask switching and size switching can be easily performed by replacing the chuck.
We
can design various photoresist development, EB resist development, dry film resist development, etc. according to customer's request.
KD-150 / 200/300
K series
Evolving next-generation wet process equipment
Our standard model has a lineup of cleaning, coating, developing, etching, peeling and all wet processes.
WRCD-A200
Coater developer
All-in-one model for coaters and developers
HMDS, coating, pre-baking, developing, and post-baking can all be done with this one unit.
WSD-700
Large-scale development
□ Square substrate developing device that can handle up to 700 mm
A special double nozzle develops a large area uniformly and well.
WSD-AW200
Multi-stage type
Developer with developer recycling function using multi-stage chamber
The upper and lower two-stage chamber structure separates the developer and rinse drainage, enabling circulation and recycling of the developer.
Etching device
Etching
We have a lineup from small diameter size for spray etching and paddle etching (acid / alkali compatible) to large equipment for □ 700 mm.
Wafer / mask switching and size switching can be easily performed by replacing the chuck.
We
can design various metal etching, Si etching, compound substrate etching, etc. according to customer's request.
KE-150 / 200/300
K series
Evolving next-generation wet process equipment
Our standard model has a lineup of cleaning, coating, developing, etching, peeling and all wet processes.
WSE-AW200
Multi-stage type
Etching device with chemical recycling function using a multi-stage chamber
The upper and lower two-stage chamber structure separates the chemical solution and rinse drainage, enabling circulation and recycling of the chemical solution.
WSE-WA200
2 chambers
Multi-chamber multi-function etcher
Two processes can be performed with one unit, such as development and etching, etching and peeling.
WSE-WA300
300mm compatible
Back side / bevel etching device
It holds the wafer surface in a non-contact manner, controls the amount of chemical solution wrapping around, and etches the wafer surface and bevel.
Peeling / lift-off device
Stripping / Lift off
A single-wafer spin stripping device that uses acid-based, alkaline-based, organic solvent-based and various chemicals.
We have a lineup from small diameter size to large equipment compatible with □ 700 mm.
Wafer / mask switching and size switching can be easily performed by replacing the chuck.
It can be designed according to customer's request such as resist peeling and various metal lift-off.
KSR-150 / 200/300
K series
Evolving next-generation wet process equipment
Our standard model has a lineup of cleaning, coating, developing, etching, peeling and all wet processes.
WSR-WA200
3 chambers
Multi-chamber high pressure jet metal lift-off device
Compared to the conventional method, metal burrs are less likely to remain, and the NMP recycling function reduces running costs.
WSR-AW200
Multi-stage type
Peeling device with chemical recycling function using a multi-stage chamber
The upper and lower two-stage chamber structure separates the chemical solution and rinse drainage, enabling circulation and recycling of the chemical solution.
Dilated single-wafer spinner
Known as the K series. Demonstration machines are also available. Up to 2 processing arms (with swing mechanism) can be equipped. * Combination can be freely selected
CE-A150
Compact automatic spin etcher
Equipped with chemical inline mix function.
A small-lot, high-mix production machine equipped with a robot as standard equipment.
WSC-WA150 NM1S
Single-wafer automatic vertical double-sided
scrub cleaning device
Cassette to cassette single-wafer automatic spin cleaning device
