Molding; Encapsulation; Decapsulation Equipment

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

manufacture of machines for the production of multilayer passive ceramic components. MLCC, MLCI, MLCV, LTCC, Electronic Manufacturing Equipment

Manufacture laser decapsulation system. Failure analysis equipment distributor

Laser marking, cutting and decapsulation machines.

Industrial X-ray inspection system and SEM (Scanning Electron Microscope). Flip chip bonder, TAB IC potting system.

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

IC decapsulation systems. Dry Etching Systems. Failure Analysis Testing System.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Products for Semiconductor Failure Analysis, sample preparation and counterfeit IC detection.

Semiconductor molding machine

Flip chip bonder, manual probers and accesoires. Laser decapsulation systems.

Post-bond inspection system, die coater, molding adhesion promoter station, cleaning station, vessel tanks

Mold chasses. Fabless mold production system.

Molding equipment for semiconductor packaging

Microwave and plasma technology. Microwave generators, plasma systems and components, magnetrons, waveguide components.

Equipment for leadframe, substrate and wafer level packaging applications.

Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation

Molding and singulation equipment for semiconductor packaging.

Semiconductor and FPD production equipment