adwelds provides ultrasonic advanced machines that cope with changes in materials or manufacturing processes to improve quality of semi condutor/electronic components. Utilizing adwelds' advanced ultrasonic bonding and ultrasonic cutting in the manufacturing processes will lead to increase clients' production value. adwelds' advanced ultrasonic machines install functions to set prcessing conditions digitally and/or to monitor each process appropriately.
Ultrasonic Bonding Process
Homogeneous/Heterogeneous Metal Bonding
ABB Process
Bonding Coated Wire
Infrared Image Sensor (Cool Bond)
IC Card (Front and back pattern pierce bonding)
Ultrasonic Cutting Process
Urethane Sheet (High precision shape cutting)
Cutting Hard Materials
Cutting Silicon Thinly
Resin Film (High Quality Full Cutting)
Resin Film (High Quality Half Cutting)
Dieless Shape Cutting with Mold
Homogeneous/Heterogeneous Metal Bonding
It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature
RELATED PRODUCTS
From research development to mass production（Ultrasonic Bonding Machine｜UB500CE）
For mass production（Ultrasonic Bonding Machine｜BP1000MS）
From research development to mass production（Ultrasonic Bonding Machine｜UP-Lite1500）
Multi feeder（Ultrasonic Bonding Machine｜RB200LS）
High functional integrity control（Ultrasonic Welding Machine｜UB2000LS）
For research development（Ultrasonic Bonding Machine｜FA700）
Metal wedling（Ultrasonic Bonding Machine｜SB400CE）
ABB Process
Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material
RELATED PRODUCTS
Multi feeder（Ultrasonic Bonding Machine｜RB200LS）
Bonding Coated Wire
After pressing down the coated wire, ultrasonic breaks the insulating layer and bonds the inner wire to an electrode directly
RELATED PRODUCTS
From research development to mass production（Ultrasonic Bonding Machine｜UB500CE）
High functional integrity control（Ultrasonic Welding Machine｜UB2000LS）
Infrared Image Sensor (Cool Bond)
Our ultrasonic bonding machine bonds 300,000 sharp-end bumps (Kyushu U) at once at room temperature, a collaboration with Kyushu University
RELATED PRODUCTS
For research development（Ultrasonic Bonding Machine｜FA700）
IC Card (Front and back pattern pierce bonding)
When pressing down the wirings on the resin film and apply ultrasonic, ultrasonic pierces the film, without pretreatment of via processing, it bonds the wires
RELATED PRODUCTS
From research development to mass production（Ultrasonic Bonding Machine｜UB500CE）
Urethane Sheet (High precision shape cutting)
Ultrasonic helps to control deformation when bonding a soft material and realizes a high precision sectional cutting
RELATED PRODUCTS
High precision cutting（Ultrasonic Cutter｜UC1000LS）
Cutting Hard Materials
Ultrasonic helps hard materials from chipping and allows high quality cutting
RELATED PRODUCTS
Cutting（Ultrasonic Cutter｜CG400LS）
Cutting Silicon Thinly
Ultrasonic controls an elastic application to deform when cutting, so it can even slice an application with a thickness of 0.2mm
RELATED PRODUCTS
High precision cutting（Ultrasonic Cutter｜UC1000LS）
Resin Film (High Quality Full Cutting)
Ultrasonic can cut 50μm film with a beautiful cross section
RELATED PRODUCTS
High precision cutting（Ultrasonic Cutter｜UC1000LS）
Resin Film (High Quality Half Cutting)
With a conventional cutting technology, a film deformed when cutting and was difficult to achieve a half-cut, but with ultrasonic assistance, it controls the film to deform and obtains stable half cutting
RELATED PRODUCTS
High precision cutting（Ultrasonic Cutter｜UC1000LS）
Dieless Shape Cutting with Mold
Bring the initial cost down to 1/10 with our cutting tools
RELATED PRODUCTS
High precision cutting（Ultrasonic Cutter｜UC1000LS）
