Handlers; Positioner Systems

automation solutions to improve the productivity of semiconductor package testing. Our automation platforms handle the growing diversity of IC package types and applications resulting from the current environment of mass customization.

Semiconductor IC/component turret packaging machines (semiconductor test handler).

Strip test handlers, film frame handlers, and strip laser marker for the semiconductor industry.

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.

Electronic test and measurement equipment.

Semiconductor test handlers

Provider of MEMS Stimulus & Test equipment. Products include Lab and volume production handlers for testing accelerometers, gyroscopes and combo devices. Complete temperature (-45 to +136˚C) range and 3 axis full ±360˚ motion.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

High-speed inspection and packaging solutions for backend processing.

Test socket, Test probe, Changeover kit, Socket layout kit, Probe card’s contactor, Strip contactor & Other testing hardware

IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

System integration in semiconductor manufacturing.

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Automatic test equipment for semiconductors, probers, taping machines, test systems, handlers.

Automated Test Equipment (ATE) manufacturer.