Polishing Equipment

CMP (Chemical Mechanical Polishing) systems and services.

Surface processing equipment for the semiconductor industry. Wafer Grinding, Polishing, CMP, Bonding/Cleaning/Brishing Equipment

Lapping, polishing, thinning and CMP equipment.

Lapping Film, Polishing Tape, Diamond Powder, Polishing Slurry, Polishing Machine

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Precision grinding, lapping, polishing, deburring and advanced materials processing equipment

Grinder, Cutting machine and Polishing machine for Sapphire /SiC/ neodymium /GaN/ ceramics / single crystal silicon / polycrystalline silicon / gallium arsenide / quartz glass / glass / crystal / carbon / germanium / ferrite and others

Inkjet Coating Systems, Polishing Machinery

Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

Wafer Backside Grinding Machine, Polishing Machine, Lapping Machine, Slicing Machine, Ingot Processing Machine

Advanced surface & sample preparation equipment and consumables.

Manufacturer of all kinds of diamond and CBN tools. Diamond wire with a wide range of diameter and grain size. Diamond wheels for Semiconductor industries.

Electronic Materials: Metal Powder Cores, MnZn, NiZn, Metal Powder Cores, Sapphire Crystal Materials, LT/LN. FPD, power molding and environment equipment.

Ultrasonic Cutting System, Polish Cut System, Single Wafer Wet Processing System, Dicing Frame Cleaner, Batch Process Automated Wafer Cleaning Systems, IPA Vapor Dryers

CMP, grinding and substrate manufacturing equipment for use in the production of semiconductor devices.

Crystal growing furnace, semiconductor cutting, grinding, polishing and other intelligent crystal processing equipment. Polishing fliuds. Quartz crucibles.

Polishing slurry, films and other materials. Surface and wafer edge polishing machines, inspection equipment.

Wet processing technology and products for the semiconductor and wafer level packaging (WLP) industries.

Thin film process equipment that enables high-tech electronic device production and development all over the world

The company provides equipment and services in the fields of silicon wafer grinding, polishing, and chip testing