Slicer

CMP (Chemical Mechanical Polishing) systems and services.

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Grinder, Cutting machine and Polishing machine for Sapphire /SiC/ neodymium /GaN/ ceramics / single crystal silicon / polycrystalline silicon / gallium arsenide / quartz glass / glass / crystal / carbon / germanium / ferrite and others

Czochralski (CZ) furnaces for producing monocrystalline ingots of silicon, germanium, gallium arsenide, and indium antimonide (InSb). Diamond wire saws and specialized equipment for shaping and polishing ingots and cutting them into wafers

Wafer Backside Grinding Machine, Polishing Machine, Lapping Machine, Slicing Machine, Ingot Processing Machine

Electronic Materials: Metal Powder Cores, MnZn, NiZn, Metal Powder Cores, Sapphire Crystal Materials, LT/LN. FPD, power molding and environment equipment.

Crystal growing furnace, semiconductor cutting, grinding, polishing and other intelligent crystal processing equipment. Polishing fliuds. Quartz crucibles.

Silicon and glass cutting, grinding and sawing machines

Semiconductor machinery for wafer slicing, grinding, lapping, polishing.

Manufacturer of furnaces for growth various methods (Czochralski, Kyropoulos, EFG, Bridgmen, HDSM and many other)

Manufacturer of Sawing - Grinding - Lapping - Polishing Process and Equipments to Green Energy Industries

Manufacturer of wafer polishing systems, solutions and materials.

Manufacturer of wire saw and ingot grinding machines for semiconductor, ceramic and sapphire materials.

Manufacturer of grinding and polishing machines for semiconductor materials