CMP Equipment Upgrades
The Entrepix Polish Head Motor Driver Combo is a field-proven direct replacement for the NSK motors and drivers for the Applied Materials Mirra polishing platform.
Chemical Mechanical Polishing (CMP) parts, polisher replacement parts, and more. Entrepix-engineered upgrades.
CMP Replacement Parts
CMP parts, polisher replacement parts, and more. Mitigate obsolescence with our sustainable supply of new parts and Entrepix-engineered upgrades. Our Shopify page helps you identify the parts you need.
Identify and Purchase Parts on Shopify
Your Home Base for Semiconductor Equipment
Looking for used or refurbished semiconductor equipment or semiconductor equipment repair? Come to Entrepix for your semiconductor needs.
CMP Field Service
Entrepix offers field support to help you keep your CMP and metrology equipment functioning. Our extensive experience with CMP equipment like AMAT Mirra polishers, IPEC 472 polishers, and Strasbaugh equipment enables us to provide knowledgeable insight, skilled repair, and thorough training.
CMP Foundry
Our team of engineers and technology experts are here to help you design and experiment with new technology and ideas. We provide CMP services to advance your technology, integrate new materials into known processes and more.
We are ISO 9001:2015 certified with more than a million wafers processed to date.
Your CMP Foundry: Contract Manufacturing and Research & Development
The Entrepix foundry can process your overflow production, provide process engineering solutions and demonstrate equipment performance prior to sales and installation.
Entrepix’ Foundry is home to a variety of wafer production services and R&D that we perform on behalf of our clients. We are here as an extension of your team to assist in device fabrication, volume production, research new processes well as demonstrate and qualify new materials, equipment and consumables.
Engineering and Technology Development for CMP
Entrepix has a knowledgeable team of engineers and technology experts to help clients in CMP, cleaning, and distributed process flows. We work with all wafer diameters from coupons to 200mm, and help our clients:
Rapidly advance technology
Study cost reduction
Integrate new materials
Develop process improvements
Screen consumables
Assess cost and productivity
Achieve flexibility in design and processing methods
Volume Production
We can help build and produce wafers to your needs and specifications for complete outsourcing and as overflow capacity. As a top 10 IDM, we’ve processed more than one million wafers and are ISO 9001:2015 certified.
We offer guaranteed cycle times and use quality systems like FMEAs, SPC, internal audits, and CARs.
In-House Processing Tool Sets
At Entrepix, we use the following processing tools to meet your success criteria:
Processing Tools Platforms
CMP AMAT Mirra: 150-200mm wafer processing
IPEC 472(2): Coupon-200mm
Post-CMP Cleans OnTrak DSS-200 Synergy: 100-200mm
OnTrak DSS-200 Series 2: 100-200mm
SRD: 75-200mm
In-House Metrology Equipment
At Entrepix, we use the following metrology tools to ensure uniformity:
Metrology Tools Platforms
Dielectric Film Thickness Thermawave Optiprobe 2600DUV
Mikropack UV/Vis/NIR Reflectometer
Conductive Film Thickness CDE ResMap 168 4-point probe
Substrate Thickness FSM 413-300
Surface Profilometer Dektak D8 (with ultralow force and 3D mapping)
Tencor P2
Precision Analytical Balance Mettler-Toledo, A and D, Sartorius
Defect Inspection KLA-Tencor SP1 TBI (200mm)
AMAT Orbot WF-736DUO
Defect Review Leica optical review (built into AMAT platforms)
Optical Microscopes Nikon Optiphot
Zeiss Ergoplan (with Nomarski DIC)
Leica stereozoom
Miscellaneous Various analytical and characterization equipment
Also Available (third party) SEM, AFM, TXRF, and other techniques (additional cost)
Materials We Polish
CMOS
Oxide
Tungsten
Copper
Barrier metals (Ta, Co, Ru)
Shallow trench
Polysilicon
Low k dielectrics
Capped ultra low k
Metal gates
Gate insulators
High k dielectrics
Ir and Pt electrodes
Refractory metals
Aluminum
Substrate/Epi
Si and SOI
GaAs and AIGaAs
InP and InGaP
Poly-AIN and GaN
CdTe and HGCdTe
Ge and SiGe
Lithium Niobate
Titanium
Quartz, glass, and silica
Sapphire
Diamond and DLC
SiC
New Applications
MEMS
Through Si Vias (TSV)
Direct wafer bond
3D packaging
Ultra thin wafers
Polymers and resists
CNT and nanodevices
NiFe and NiFeCo
Al and stainless steel
Detector arrays
Magnetics
Photonics and solar
LED and optics
Power devices
Analog and RF
FINFET structures