Our wide range of ion beam and plasma processing equipment is flexible and modular in design, thus can be configured easily for research applications and for high volume production, for example in either a "cluster" or "inline" configuration. Our experienced and qualified team assists you to find the optimal system design for your production requirement.
ION BEAM ETCHING SYSTEMS
scia Mill 150
for full surface etching of
substrates up to 150 mm
scia Mill 200
for full surface etching of
wafers up to 200 mm
scia Mill 300
scia Mill 300
for full surface etching of
wafers up to 300 mm
ION BEAM TRIMMING SYSTEMS
scia Trim 200
for precise surface correction
of wafers up to 200 mm
scia Finish 1500
for polishing error correction on
substrates up to 1500 mm
ION BEAM SPUTTERING SYSTEMS
scia Coat 200
for high quality multilayer
deposition on up to 200 mm
scia Coat 500
for large area multilayer deposition on up to 500 mm x 300 mm
MAGNETRON SPUTTERING SYSTEMS
scia Magna 200
for advanced wafer coatings
of up to 200 mm
scia Multi 680
for multilayer coating of large
substrates up to 680 mm
scia Multi 1500
for multilayer coating of large
substrates up to 1500 mm
PECVD/RIE SYSTEMS
scia Batch 350
for 3D - coatings in batches
scia Cube 300
for large area coating and etching
over 300 mm x 200 mm
scia Cube 750
for large area coating and etching
over 750 mm x 750 mm
DRY CLEANING SYSTEMS
scia Clean 800
for high-quality cleaning and qualification
up to 800 mm dia. and 500 mm height
scia Clean 1000/1500/3000
for high-quality cleaning and qualification
up to 3 m dia. and 3.4 m length
ELECTRON BEAM EVAPORATION SYSTEM
scia Eva 200
Glancing Angle Deposition for precise nano-structures on up to 200 mm wafers
CUSTOMIZED SYSTEMS
Tailor Made Solutions
for your needs, in different configurations
