Frontier Semiconductor (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.

Film Stress
Film Adhesion
3DIC TSV Process Control
Thin wafer metrology
Electrical Characterization
Low Coherence Interferometry
Laser Scanning
Raman Spectroscopy

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