Back Grinder Tape Sticker

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc.

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Wafer mounters, tape and dry film laminator and remover, UV irradiation equipment for tapes and films.

Backgrinding, DAF die attach films, surface protection films, molding compounds.