C SUN Ltd

 , TW Manufacturer
Thermal equipment, Plasma Systems, Wafer and Panel Lamination and Bonding Machines

Takatori Corporation

 , JP Manufacturer
Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Shenyang Heyan Technology Co., LTD

 , CN Manufacturer
Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc.

Shenyang Hanway Science & Technology Co., Ltd

 , CN Manufacturer
Dicing saw machines and parts: spindles, dicing wheels, linear motion guides etc. Wafer tape mounter, lamination machine.

Teikoku Taping System Co., Ltd

 , JP Manufacturer
Wafer mounters, tape and dry film laminator and remover, UV irradiation equipment for tapes and films.

NITTO DENKO CORPORATION

 , JP Manufacturer
Backgrinding, DAF die attach films, surface protection films, molding compounds.

Powatec GmbH

 , DE
Manufacturer of Wafer Mounters, Laminators, UV curing stations, as well as accessories such as frames, films, magazines.

LINTEC Corporation Advanced Materials Operations

 Tokyo, JP Manufacturer
Manufacturer of adhesive tapes for backgrinding and dicing, laminators and other equipment.