Wafer Mounter

UV irradiator, Wafer Laminator, Tape Mounter, Plasma Cleaner. Semiconductor Factory Automation: OHT, Stocker, Bonding Automation. Precision machined equipment parts.

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Wet Cleaning Systems and Chemicals, UV Ozone Cleaner, Wafer Mounter, Wafer Expander, Grip Ring, UV Curing System

Automatic Wafer Loader, Automatic, Semiauto and Manual Wafer Mounter, Automatic and Manual Wafer ID and Frame ID Reader and Automatic Wafer Packer / Unpacker / Sorter

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

Dicing saw, laser saw, auxillary equipment

Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc.

Dicing saws, dicing blades, wafer cleaners and mounters, UV curing system, water recycling equipment

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Wafer mounters, tape and dry film laminator and remover, UV irradiation equipment for tapes and films.

Backgrinding, DAF die attach films, surface protection films, molding compounds.

FPD manufacturing equipment. Wafer mounter, wafer cleaning machines, die bonders. Laser cutting, marking and solder ball welding machines.

Manufacturer of Wafer Mounters, Laminators, UV curing stations, as well as accessories such as frames, films, magazines.

Manufacturer of adhesive tapes for backgrinding and dicing, laminators and other equipment.