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Drying Equipment

Drying equipment is used to remove liquids from surfaces, including wafers. The drying process is crucial for several applications, such as cleaning, etching, and coating. There are various types of drying equipment available, including spin dryers, hot air dryers, convection dryers, and ultraviolet (UV) dryers. Spin dryers work by spinning the wafers at high speeds to remove the liquids from the surface. These dryers are suitable for removing small amounts of liquids from wafers. Hot air dryers use hot air to evaporate the liquids from the wafers. These dryers are typically used in high-volume applications, where fast and efficient drying is required. Convection dryers work by circulating hot air around the wafers to evaporate the liquids. This type of dryer is ideal for drying delicate wafers or those with intricate patterns. UV dryers use UV light to dry the wafers. The UV light evaporates the liquids, leaving the wafers dry. These dryers are ideal for drying thin films, photoresist, and other delicate materials. Different types of drying equipment are suitable for different applications, and the choice of equipment depends on the type of liquid being removed, the size of the wafer, and the desired drying speed. The selection of a wafer drying process depends on several factors, including: Type of material: Different materials require different drying processes. For example, porous materials may need a gentler drying process than non-porous materials. Size and shape of the wafer: The size and shape of the wafer can affect the drying process. For example, large or irregularly shaped wafers may require a more advanced drying process. Cleanliness requirements: The level of cleanliness required for the wafer will impact the drying process. For example, if high-purity cleanliness is required, a more controlled and gentle drying process may be needed. Drying time: The drying time required will also impact the selection of the drying process. Some processes may take longer but result in a cleaner wafer, while others may be faster but may result in residual moisture or contaminants. Cost: The cost of the drying process is also a factor to consider. Some drying processes may be more expensive, but result in higher quality wafers, while others may be more affordable but result in lower quality. It is recommended to consult with a technical expert to determine the best drying process for a particular application.Several companies manufacture wafer drying equipment, including: ASM International Lam Research Applied Materials TEL (Tokyo Electron) KLA Corporation Entegris, Inc. Novellus Systems Dainippon Screen Manufacturing Co., Ltd. AIXTRON SE AMEC Note that this list is not exhaustive and there may be other manufacturers of wafer drying equipment as well.

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CLEAN & SMART ENGINEERING Co., Ltd

, KR Manufacturer

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

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LEAD Engineering Co., Ltd

, KR Manufacturer, Service Company

Manufacture Furnaces. Refurbishment and relocation of diffusion furnaces and RTP equipment. Spare parts

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Chemical Art Technology Inc./CAT

, JP Manufacturer

Wet process equipment, scrubber, cleaning/drying equipment, quartz products

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Wafer Process Systems Inc, WPS

, US Manufacturer

manual, semi-automated and fully-automated dry In / dry out wet benches and wet chemical process equipment used in the manufacturing of microelectronic devices, MEMS devices, computer disc drive media and slider assemblies, flat panel displays and PV.

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JAPAN CREATE Co Ltd

, JP Manufacturer

Wafer cleaning system, wafer etching system, Spin dryer, Wafer scrubber, Spray developer, Spray Echer, IPA Vapor dryer, Mask cleaner.

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Yield Engineering Systems, YES

, US Manufacturer

"Lab-to-fab" range of vacuum curing, monolayer coating, wafer and panel bonding and plasma cleaning systems.

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SAWATEC AG

, CH Manufacturer

Lithography hotplates, cpin modules, spray coaters, developers, spin rinser dryers. Combined and cluster systems. Components: chucks, pumps, valves.

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AP&S International

, DE Manufacturer

P&S International is one of the leading providers of batch- and single wafer wet process solutions for the semiconductor-, MEMS- and micro-structuring industries worldwide.

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Micro-Tech Systems Inc

, US Manufacturer

Drying Cleaning & Surface Preparation Stripping Texturing Etching Electroplating Equipment

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Rehm Thermal Systems GmbH

, DE

Manufacturer of reflow soldering systems with convection or condensation and drying and coating systems.

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