Wet Etching Equipment

WET is a professional etching processing company, we can achieve a perfect etching tolerance of ±0.005mm. For stainless steel, copper, nickel, etc.

Semiconductor: Wet Etching & Cleaning Solutions RTP(Rapid Thermal Processing). Display: Thermal Process Solutions In-Line Solutions, Inspection Process Solutions. Robotics.

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

Thermal equipment, Plasma Systems, Wafer and Panel Lamination and Bonding Machines

High-end wet process equipment supplier

manual, semi-automated and fully-automated dry In / dry out wet benches and wet chemical process equipment used in the manufacturing of microelectronic devices, MEMS devices, computer disc drive media and slider assemblies, flat panel displays and PV.

Wet process stations, Resist processing equipment, Dicing equipment, PCB processing equipment

20-nano-class semiconductor silicon wafer cleaning equipment.

PCB, Photo Chemical Milling (PCM), Surface Finishing, Thermal Processing Furnaces and Ovens, Automation Equipment. Solar production equipment.

Equipment, systems & components for semi- and fully automatic wafer processing. Engineering, refurbishment & repair of optical, mechanical & electromechanical components.

Wet etching equipment, high purity chemicals and gases delivery system.

Wafer cleaning system, wafer etching system, Spin dryer, Wafer scrubber, Spray developer, Spray Echer, IPA Vapor dryer, Mask cleaner.

Machines, plants and systems in the area of vacuum coating technology, surface processing, wet-chemical as well as thermal processing technology.

Surface preparation equipment and processes, including WET BATCHSPRAY systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.

Wet processing and chemical system R&D, manufacturing and integration

Wet Progress and Chemical Delivery System for Microelectronics

Wet processing systems and related components

Ultra-pure chemicals, lead frames treatment and post packaging treatment chemicals, equipment for the relevant processes: through Silicon Via, Micro-Bumping, MEMS, Solar Cells and other wafer level plating materials.

Deposition: PECVD System, LSCVD® System, ALD System. Etching: Reactive Ion Etching System, ICP Etching System, Si Deep Reactive Ion Etching System, XeF2 Etching System. Surface Treatment: Aqua Plasma® Cleaner, Plasma Cleaner, UV Ozone Cleaner