Semiconductor EP(Electro Plating) Equipment Provider. TKC Products: 1. Wafer EP equip. (RDL, BUMP, TSV) 2. Single Cell EP equip. 3. Wafer Cu-Ni-Au Plating equip. for LED 4. Pattern copper Plating equip. (Vertical continuous plating) 5. Panel via fill copper plating equip. (Vertical continuous plating) 6. full auto Ni-Au Plating equip. 7. Non-contact vertical DF / SR develop equip. 8. vertical auto desmear / PTH
