Wafer De-Bonder

Maskless photo lithography equipment, Laser de-bonding equipment, inspection and sorting equipment

mask aligner and photolithography specialists providing custom-engineered contact/proximity mask aligners.

Virtual clean room environment for advanced prototyping and pilot-line production. Spin Coaters, Bake Plates, Spin Developers/Clean, Temporary Bond & Debond.

Mobile Electrostatic Carrier Platform for Temporary Bonding

Production and sales of microfabrication equipment in the field of semiconductor and MEMS.

FPD Equipment:vacuum assembling (SE-LCASV), panel misalignment inspection, Wafer vacuum assembling equipment, X-ray bump/void inspection equipment, Macro inspection equipment, LASER debonding and cleaning equipment, Nanoimprint equipment.

Semiconductor and FPD manufacturing equipment. Cleanroom transfer robotics. UV irradiation systems. Precision molds and dies.

Thermal wafer test technology. Thermal Chucks. Thermal Debonding Machines. Warpage Adjustment Tools.

Etch protective coatings. Antireflective coatings, multilayer systems, EUV underlayers for lithography. Bonding, de-bonding and other materials and equipment for wafer level packaging.