Wafer Identification and Marking Equipment

Laser processing equipment for semiconductor, display, PCB

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Crystal growing furnaces (Si, GaAs, Sapphire) and parts, wafer laser marking machine, wafer handling manipulator, wafer diffusion furnace, thermal process equipment, quartz crucible manufacturing equipment.

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Semiconductor Assembly equipment, Sapphire Wafer Process Equipment, Precision mold & die parts manufacturing

Display equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, OLED and FPD AOI Inspection and laser process equipment. Semiconductor equipment:FOUP Packing Machine, Wafer Grinder, Laser process equipment.

manufacturer of equipment and systems for resistance welding, laser welding, laser marking, laser cutting, laser micromachining, and hot bar bonding

Laser marking, cutting and decapsulation machines.

Material handling automation for semiconductor industry and and equipment suppliers.

Fab Infrastructure and Services. Facility Monitoring System, FAB Gas Control, Vision and Marking System.

LED equipment: LED Prober, Sorter, Die Transfer, Taping Machine, Phosphor Coater, CSP Blade Cutter, Dispenser. FPD Equipment: Laser Lift-Off, Laser Cutting System, Prober. Laser scribing and marking. Die (chip) transfer systems.

Wafer, Reticle and Package Inspection Systems. Lasrer Marking Systems. Auto Scope System.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Vison Inspection System, Wafer Measurement System, Wafer Handling System

Test interface design and manufacturing services for Automated Test Equipment (ATE) and high speed DieMark® inking systems used to mark defective devices at wafer level test.

Automation machines and manufacturing solutions for Advanced Semiconductor Packaging and Smart Labels / RFIDs as well as for new developmental products such as Optoelectronics, MEMS, Photonics industries etc. Solder ball mounter,

Semiconductor equipment manufacturer and distributor

Automated machines for semiconductor and other high tech industries