AmTECH Microelectronics is a custom microelectronics assembly and advanced packaging services company located in Silicon Valley, CA. The company specializes in prototype to low-medium volume production on-shore manufacturing. AmTECH’s processes include, flip chip, die bonding, wire bonding, encapsulation, and SMT assembly. In business since 1993, the company features a clean room and state-of-the-art automated equipment.
AmTECH Services and Capabilities:
Flip Chip Die Bonding (1um placement accuracy)
High Volume Precision Die Bonding (8 um placement accuracy)
Small Diameter .8mil – 2 mil Wire Bonding (Au & Al)
Large Diameter Wire Bonding 4 – 20 mil (Al)
Ball Bonding, Wedge Bonding, Ribbon Bonding
Encapsulation, Dam & Fill, Underfill
Silver Sintering Bonding (pressureless)
Eutectic Die Bonding
SMT Assembly down to .01005 components
