Technical Intelligence; Reverse Engineering

Provider of product engineering and semiconductor design services.

Engineering Service Provider with a cutting edge focus on the development and design of ASICs, SoCs, FPGAs, Embedded Software and discrete Systems.

Expertise in the analysis of markets, technological developments and supply chains, as well as the strategy of key players in the semiconductor, photonic and electronic sectors

Market Intelligence

IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.

Technology commercialization advisory and consulting service

High tech services and solutions provider for Semicon, Analytics, Medical and Automotive.

Technology trend and market research analysis for front- and back-end chip manufacturing.

economic oriented research to advance scientific discovery and develop innovative technology.

consulting company in the field of advanced semiconductor packaging technology

provider of advanced technology analysis and intellectual property services. Reverse engineering, IP services.

ASIC project management company

Failure Analysis, Quality Control and Material characterization services.