Advanced Ultrasonic Machining of Silicon, Ceramics and Glass for Semiconductor and MEMs applications. For over 30 years, ultrasonic machining has been used to drill thousands of holes or features simultaneously in silicon, silicon carbide and other advanced ceramic substrates. These substrates are then used in the manufacture of gas distribution plates required for plasma etching and other semiconductor manufacturing applications. In similar applications, ultrasonic machining is used to drill multiple holes simultaneously in glass substrates used in the manufacture of MEMs devices.
Bullen’s Ultrasonic Machining process is a non-thermal method, creating no HAZ (Heat Affected Zone) and little to no subsurface damage. As a result, no post-machining polishing is needed to relieve residual stress and slag caused by laser machining or EDM. That means a faster and more cost-effective process for your team.
Ultrasonic machining is a loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials. Material removal begins with a vibrating tool. The vibration propels particles at accelerations in excess of 25,000 g’s. These dynamic particles collide with and grind the workpiece on a micro-level.