Measurement; Inspection Service

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

Global Silicon Carbide wafer manufacturing innovator. 150mm and 200mm Silicon Carbide (SiC) Ingot and Wafer for RF and Power Electronics. SiC Wafer Reclaim

MEMS foundry

Advanced thin film processing services. PVD Films, Thermal Oxides & Annealing, Silicon Wafers

NEMS develops plasma technologies and provides plasma surface treatment solutions, including vacuum and atmospheric plasma machines. NEMS plasma machines can be used for surface cleaning surface etching and surface modification

Service company for high tech equipment like: evaporation units, plasma and etch systems, leak detectors, purifiers, instrumentation for microelectronics, nanotechnology, optics and cryogenic systems, custom vacuum design and gauge calibration

Wafer slicing, dicing, grinding and polishing equipment and blades. Probing machines. CMP Equipment. Precision measuring equipment.

Manufacturer of LED, PD, VCSEL chips and VCSEL driver chips, TIA chips and optical communication components.

300mm semiconductor grade screening and evaluation services for materials, processes, chemicals and consumables from laboratory scale to production scale (for ULSI) for IC manufacturers and suppliers.

Functional packaging solutions for MEMS and integrated sensor systems primarily for automotive and industrial applications.

Specializing in slicing, grinding, dicing and characterization of brittle materials like sapphire, silicon, GaAs, ceramics and all kinds of single crystals.

Manufacturer of silicon wafers and parts. Thin film deposition and custom fabrication services for research and production.