Coherent Corp., a provider of advanced semiconductors and optical networking solutions, announced that it has developed the world’s first 6-inch indium phosphide (InP) wafer fabrication technology at its facilities in Sherman, Texas, and Järfälla, Sweden. This development marks a significant advancement, allowing Coherent to boost its production capacity and reduce the manufacturing costs of InP optoelectronic devices. These devices are crucial for a variety of applications, including coherent optical communications, datacom transceivers, AI interconnects, advanced sensing for consumer electronics, and wearables, as well as medical and automotive applications. They are also expected to play a key role in the future of 6G wireless and satellite communications networks.
Dr. Giovanni Barbarossa, Chief Strategy Officer and President, Materials Segment, expressed enthusiasm about the announcement, highlighting it as a fruition of Coherent's sustained investment in innovation, technology development, and extensive experience in high-volume VCSEL array manufacturing for mobile handsets. He emphasized that vertical integration at scale has been a fundamental strategy, enabling their optoelectronics products to excel in the market by ensuring top-notch quality, performance, efficient time to market, and cost-effectiveness.
Dr. Beck Mason, Executive Vice President, Telecommunications, remarked that the shift to 6-inch wafers would significantly increase productivity, including the ability to manufacture four times the number of devices per wafer, and achieve over 60% in die cost reduction. It also aligns with the company’s goal to modernize its fabs with higher-capacity and more efficient automated process tools. This enhancement is poised to meet the rising demand for their indium phosphide products across various key markets, bolstering competitiveness and profitability.
The company is currently in the midst of verifying numerous existing products on this new 6-inch InP platform. This includes a 200G electro-absorption modulated laser (EML), a 200G distributed-feedback laser and Mach-Zehnder modulator (DFB-MZ), a 100G EML, high-speed photodetectors, and high-power CW lasers tailored for silicon photonics applications. Coherent anticipates transitioning the majority of its production from 3-inch to 6-inch InP wafers in the forthcoming years. This strategic move is expected to capitalize on the benefits of larger wafer size, enhanced yield, and superior performance, cementing a sustainable competitive advantage in the communications and sensing markets.
