CSEM, a leading technological innovation company, provides comprehensive support to the photonic community through its advanced services based on the standardized Thin-Film Lithium Niobate on Insulator (TFLN) Photonic Integrated Circuit (PIC) platform, process design kit (PDK), and 150 mm wafer-scale fabrication process.
The TFLN PIC platform offered by CSEM includes manufacturing and testing of Photonic Integrated Circuits in 150 mm wafer-scale processes. This platform is tailored for prototyping and research and development, offering a unique combination of device layers, metallization steps, cladding, and seamless chip facets, enabling intricate PIC designs, hybrid integration, and easy electrical and packaging interfacing.
The Process Design Kit (PDK) for TFLN PICs at telecommunication C-band provides a set of active and passive building blocks, technology layers, and design guide documentation. CSEM also equips PIC designers with parametric cells (PCell) for the building blocks, enabling customization within fabrication design rules, thereby streamlining layout and circuitry of customized PICs.
CSEM's offerings for TFLN PICs include Multi-Project Wafer (MPW) runs, customizable dedicated runs, design services, testing, and demo chips. The MPW runs comprise two options: "Full stack: TFLN-Active-3WG2MET" and "Fast: TFLN-Active-1WG1MET," each with specific technology features, deliverables, and order criteria. Additionally, the dedicated runs offer customized stack options and flexible starting dates, enabling fast delivery for reduced technology nodes.
The company's design services cover a wide range of technology features, including passives and actives building blocks from visible to IR, offering design consultation, simulation, layout, and characterization services. Moreover, CSEM provides testing services for passives and actives building blocks in Telecom C-Band, including options for insertion loss, EO bandwidth, and characterization reports.
For those interested in evaluating the platform, practicing electrical and optical interfacing, and conducting packaging and reliability tests, CSEM offers demo chips in various configurations, such as full stack, only passive, only active, and only metals.
CSEM's commitment to supporting a robust MPW life cycle includes assisting photonic designers at every stage, from systematic Design Rule Check (DRC) during design submission to functional-level consulting. The company also provides advice to optimize PIC designs for superior performance.
With an ISO9001-certified 150 mm wafer foundry and a high level of confidentiality, CSEM's TFLN PIC foundry services offer unmatched expertise and technology to cater to the diverse needs of the photonic community.
CSEM's TFLN PIC foundry services stand at the forefront of innovation, offering tailored solutions for prototyping, research and development, and cutting-edge applications in telecommunications, data centers, quantum, and beyond. Collaborating with CSEM ensures leveraging the full potential of TFLN technology for pioneering projects in the photonic domain.
