The semiconductor industry is facing challenges as traditional scaling metrics fail to meet emerging technological demands, prompting the need for a reevaluation of compute systems. The NanoIC pilot line aims to drive innovation through collaboration by focusing on advanced logic, novel memory solutions, and advanced interconnect technologies. This initiative aligns with the European Chips Act, positioning Europe to enhance its competitiveness in critical markets such as computing, communication, and automotive sectors.
To facilitate the transition from research to commercial applications, a robust lab-to-fab conduit is vital. The NanoIC project will provide a state-of-the-art beyond-2-nm system-on-chip (SoC) pilot line, enabling access to cutting-edge semiconductor technologies for the entire ecosystem. As one of four innovative pilot lines approved by the Chips Joint Undertaking, it emphasizes large-scale capacity building and innovation support.
The consortium leading the NanoIC initiative consists of esteemed institutions, including imec, CEA-Leti, and Fraunhofer-Gesellschaft. These organizations will leverage their combined expertise to advance European technological leadership in semiconductors. The project incorporates significant support from government bodies and aims to bridge the gap between academic research and industrial production.
Looking ahead, the transition from traditional complementary metal oxide semiconductor (CMOS) technologies to more advanced architectures like gate-all-around nanosheet devices is crucial. As new applications such as artificial intelligence and autonomous vehicles emerge, there is a pressing need to rethink compute systems. The introduction of nanosheet devices is expected to enhance the scalability and performance of semiconductors significantly.
Among memory innovations, exploring concepts like spin-orbit torque magnetic RAM (SOT-MRAM) and 2-transistor-0-capacitor-embedded DRAM is becoming increasingly important. Additionally, the development of chip-to-chip interconnect technologies is necessary to tackle memory capacity challenges and partition functionalities in SoCs.
Within the NanoIC pilot line, cutting-edge technologies and research into new materials will be spearheaded. Advanced logic flows will support nanosheet and CFET architectures while incorporating sustainable practices. The integration of advanced memory technology and hybrid bonding connectivity is prioritized to enable innovative chiplet architectures.
Process design kits (PDKs) will be provided to designers for system exploration and prototyping, facilitating virtual testing of new designs. As the initiative progresses, it builds on earlier projects under the Chips JU, aiming to benefit a range of industrial sectors.
Through collaboration among integrated device manufacturers, foundries, and equipment suppliers, the NanoIC pilot line is poised to strengthen the European semiconductor ecosystem. This strategic effort signifies Europe's commitment to sustainable growth and innovation in the digital age, ultimately seeking to consolidate its leadership in the global semiconductor market. The focus on research and development, alongside newfound collaboration, showcases a pathway to navigate future challenges in semiconductor technology.
