The Japanese and U.S. industry ministers, Yasutoshi Nishimura and Gina Raimondo, respectively, have agreed to enhance collaboration on the development of next-generation semiconductors. In addition to reinforcing global supply chains with other partners and through multilateral engagements such as the Indo-Pacific Economic Framework, the two officials confirmed the need to dramatically speed up Japan-U.S. cooperation.

Japanese Economy, Trade and Industry Minister Yasutoshi Nishimura (2nd from R) holds talks with U.S. Commerce Secretary Gina Raimondo (2nd from L) in Detroit, Michigan, on May 26, 2023. (Kyodo) ==Kyodo

The joint statement declared that this cooperation will involve artificial intelligence, cybersecurity, bio-related, and quantum technologies, in addition to semiconductor research centers of the two countries working together to create a technology roadmap and human resources needed for chips. The two officials also agreed to hold a second "two-plus-two" economic dialogue, building on their first bilateral talks that took place in July last year. These efforts come as Japan, the United States, and their partners aim to create a system to help safeguard key industrial materials in the face of China's economic coercion and rising influence in the chip sector. During their meeting, Nishimura and Raimondo stressed the importance of diversifying geographically chip production. The annual Asia-Pacific Economic Cooperation forum ministerial meeting failed to issue a joint statement due to differing views over Russia's war in Ukraine.