Tower Semiconductor has launched its new 300mm Silicon Photonics (SiPho) process as a standard offering for its semiconductor foundry services. This advanced process is designed to complement the existing 200mm SiPho platform, which is currently in high-volume production, catering to the increasing demand for high-speed data communications in next-generation datacom applications.
The 300mm process boasts industry-leading silicon waveguides and advanced low-loss silicon nitride waveguides, ensuring superior performance in optical communications. The larger wafer size improves compatibility with industry-standard OSAT (Outsourced Semiconductor Assembly and Test) platforms, facilitating better integration with electronic components and enhancing overall operational efficiency.
Dr. Edward Preisler, Vice President and General Manager of the RF Business Unit, expressed pride in the new offering, emphasizing that it provides a smooth transition for existing customers toward advanced technology on 300mm wafers. He highlighted that the 300mm process builds on Tower’s well-regarded 200mm SiPho platform by offering continuous process improvements and greater supply flexibility for its customers.
