200 and 300 mm Automated Probe Systems. The Dedicated Solution for Silicon Photonics Device Characterisation


Dedicated for silicon photonics on-wafer test

• Including various options of high-precision fiber alignment systems for ultra-fast scanning routines

• Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration

• Integrated Z-sensing for detecting the fiber to wafer contact point

• Crash protection when using two optical fiber arms • Temperature capability from -50 °C to 200 °C

• Optional dark box for testing in light tight environment System compatibility

• 200 mm: TS2000-IFE and TS2000-SE

• 300 mm: TS3000, TS3000-SE, TS3500 and TS3500-SE