Solar Silicon technologies, LLC is the Russian manufacturer producing and selling monocrystalline and multicrystalline silicon wafers for solar energy market. Modern production site is located in the Central part of the Russian Federation, on the territory of the former PCMP plant in Podolsk. The annual production capacity of monocrystalline and multicrystalline silicon wafers for high-efficiency photovoltaic modules makes 220 MW.

MONOCRYSTALLINE
WAFER


Specification:


Method : Dimond wire sawing
Type: (p-type)
Specific electric resistance from 0,5 to 1,5 Ω·сm
Life time of minority charge carrier,> 20 microseconds;
Oxygen concentration < 9 · 1017
Carbon concentration < 1 · 1017
Length 156,75±0,25 mm ;
Diagonal 210 ± 0,25 mm;
Chamfer length 8,5 ± 0,5 ;
Thickness 190 ± 10 µm;
TTV < 30 µm;
Bow < 50 µm;
Saw marks depth  < 10 µm;;
Chips no more than 0,3 mm;
Microcracks, spots, holes – not present
Find more about the production process

MULTICRYSTALLINE
WAFER


Specification:


Method : Dimond wire sawing ;
Type: (p-type)
Specific electric resistance from 1,0 to 3,0 Ω·cm
Life time of minority charge carrier,> 3,5 microseconds;
Oxygen concentration < 5 · 1017
Carbon concentration < 5 · 1017
Length 156,75 ± 0,25 mm
Diagonal 220,2 ± 0,5 mm
Chamfer length 0,5 – 2 mm
Thickness 190 ± 10 µm
TTV < 30 µm
Bow < 50 µm
Saw marks depth < 10 µm
Chips no more than 0,3 mm;
Microcracks, spots, holes – not present

 

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