Anchor is a pioneer and a worldwide leader in semiconductor pattern-centric hotspot management and analysis software, supplying both foundries and IDMs with a suite of software solutions to improve manufacturing efficiency and chip yield. Anchor is part of KLA Corporation. Anchor helps leading edge foundries to resolve the rapidly increasing challenges of analyzing and managing significant volumes of Defect and CD metrology data from the fab, determining process critical design patterns, and optimizing fab processes. Anchor solutions integrate data from multiple sources in fab with pattern-centric learning for Design, OPC, Lithography, Defect, Metrology and other Process teams.
Applications and Toolkits
Applications are products with GUIs and core engines combined to provide complete solutions.
Toolkits are composed of core engines that customers can use to develop their own automated workflows.
D2DB-PM: Die-to-Database Pattern Monitor
Take line monitoring to the next level with Die-to-Database Pattern Monitor. Tap the full potential of SEM images in ways that redefine production line monitoring for advanced technology nodes. Build the first of its kind 'Printed Pattern Database' and leverage that infrastructure to enable vast new opportunities for line monitoring and yield enhancement.
Application
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PCYM: Pattern Centric Yield Manager
Intelligently decompose a full chip layout to generate a Design Decomposition Database. Rank the process marginality of all patterns of interest using a variety of empirical, statistical, and simulation techniques. Apply risk scores to bias care areas, review sampling, and more. Compare two or more layouts to identify similarities and differences, and proactively assess risk areas of new tape-outs.
Application
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PCML: Pattern Centric Machine Learning
Leverage the power of D2DB-PM and PCYM to generate and apply automated machine learning models that learn from real silicon data to make full-chip pattern risk assessments. Risk assessments can made to the patterns of most layers at most process steps.
Application
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PWA: Process Window Analyzer
Leverage the power of die-to-database to generate Bossung curves for any number of patterns. Comprehensively study patterning behavior across modulations to establish effective process windows.
Application
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ADD: Advanced Defect Discovery
Apply cutting edge patch image processing and machine learning techniques to create robust review sample plans for SEM Review that can optionally leverage the PCYM risk-scored pattern database.
Toolkit
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IE: Image Explorer
Create your own custom solutions by integrating Anchor's powerful and vendor-neutral image processing technology for contour extraction, alignment, search, and defect detection. Image Explorer provides a toolkit of functions that empower you to create elaborate solutions for your unique applications.
Toolkit
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I2DC: Image to Design Contour
I2DC (Image to Design Contour) is a specialized tool for the OPC / Lithography engineer who needs to compare simulation with real silicon to analyze the OPC workflow and perform adjustments as needed. It provides powerful image processing features to help engineers identify the design intent. And advanced tools such as multi-layer handling and image stitching enable shot level analysis.
Toolkit
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M-DPL: Multi-User Defective Pattern Library
Benefit from the collective experience of multiple teams in the fab by building a central defective pattern library and using it for pattern search, care area generation, risk analysis of new devices, comparison to OPC-simulated weak points, correlation with electrical fault analysis results, and other use cases.
Application
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NanoScope PRV
NanoScope PRV is a model-based, pattern-centric full chip Post-RET/OPC verification software solution. It is a production-proven, distributed-computing application providing accurate lithography process modeling, comprehensive defect detection and analysis, and process window limiting pattern extraction.
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