DISCO Corporation

 , JP Manufacturer
Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

OKAMOTO MACHINE TOOL WORKS,LTD

 , JP Manufacturer
Wafer Backside Grinding Machine, Polishing Machine, Lapping Machine, Slicing Machine, Ingot Processing Machine