Wafer Back Grinding Machine Series
In-line grinder for less than 25um thickness GDM300
200mm back grinder GNX200B
300mm back grinder GNX300B
300mm Ultra thin wafer polisher GNX12PB
Ultra accurate back grinder SVG202MKⅡ
Grinder for brittle material SVG401MKⅡ
Polishing Machine Series
450mm wafer final polisher PNX1200/PNX1200S
Polishing machine SPP series
CMP～Chemical mechanical polishing～ SPP600S
Oscar type polishing machine SPP3800
Final polisher PNX332B
Rectangle table polisher SPH3000
Lapping Machine Series
Table type lapping machine SPL15T
High accuracy lapping machine SPL15F
Large size lapping machine SPL120
Slicing Machine Series
Multi Slicer ASM420M
300mm Internal blade slicer ASM200BR
Ingot Grinding Machine Series
PV ingot complex grinding machine SiSG156HT
OKAMOTO MACHINE TOOL WORKS produces the following types of machines
Conventional type Precision Surface Grinding Machine
CNC Precision Surface Grinding Machine
Double Column Type Surface Grinding Machine
Rotary Surface Grinding Machine
Precision Form Grinding Machine
Ultra Precision Form Grinding Machine
Precision Cylindrical Grinding Machine
Internal Grinding Machine
Universal Grinding Machine
Center Hole Grinding Machine
Gear grinding Machine
Specialized Grinding Machine
Consumer & Special designed device
Wafer Backside Grinding Machine
Polishing Machine
Lapping Machine
Slicing Machine
Ingot Processing Machine
and also a huge variety of materials: surface, heavy duty infeed, grinding wheel forming, hard materials, free form surface, fine forming, mirror surface, cylindrical, internal.
