Grinding Equipment

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Surface processing equipment for the semiconductor industry. Wafer Grinding, Polishing, CMP, Bonding/Cleaning/Brishing Equipment

Lapping, polishing, thinning and CMP equipment.

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Production and sales of precision tooling, leadframe: IDF, PDIP, SOT-23, SOT-223 QFP/TQFP/LQFP, SOP, SO, SSOP, PLCC, TSOP, .Motor core and surface grinder.

Precision grinding, lapping, polishing, deburring and advanced materials processing equipment

Display equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, OLED and FPD AOI Inspection and laser process equipment. Semiconductor equipment:FOUP Packing Machine, Wafer Grinder, Laser process equipment.

Grinder, Cutting machine and Polishing machine for Sapphire /SiC/ neodymium /GaN/ ceramics / single crystal silicon / polycrystalline silicon / gallium arsenide / quartz glass / glass / crystal / carbon / germanium / ferrite and others

Inkjet Coating Systems, Polishing Machinery

Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

Wafer Backside Grinding Machine, Polishing Machine, Lapping Machine, Slicing Machine, Ingot Processing Machine

Surface grinding machines

Manufacturer of all kinds of diamond and CBN tools. Diamond wire with a wide range of diameter and grain size. Diamond wheels for Semiconductor industries.

Motion control systems, Press tool and die systems, Machine tools and measurement.

Grinding machines. Cutting and Grinding Wheels and other machine parts.

Tools and Equipments related to semiconductors and power semiconductors. CVD and PVD coatings.Numerical control devices for machine tool.

Electronic Materials: Metal Powder Cores, MnZn, NiZn, Metal Powder Cores, Sapphire Crystal Materials, LT/LN. FPD, power molding and environment equipment.