Wafer Manufacturing Equipment

WET is a professional etching processing company, we can achieve a perfect etching tolerance of ±0.005mm. For stainless steel, copper, nickel, etc.

Dielectric Dry Etch System that applies our own specialized plasma source technology.

Steam two-fluid cleaning systems, highly concentrated ozone water cleaning equipment.

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Single wafer processor, Wafer scrubber, hybrid wafer cleaner system

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

CMP (Chemical Mechanical Polishing), Wet Cleaning Systems. Display Equipment: Wet Station, APP (Atmospheric Pressure Plasma Cleaner), CO₂Cleaner, Coater & Track System. CMP Slurry and nano dispersion solution

Laser processing equipment for semiconductor, display, PCB

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

CMP (Chemical Mechanical Polishing) systems and services.

Laser marking, dicing and scribing equipment for wafers, wafer thickness measurement equipment, substrate defect detection machine

Surface processing equipment for the semiconductor industry. Wafer Grinding, Polishing, CMP, Bonding/Cleaning/Brishing Equipment

Clean room air purification, high-precision control of temperature and humidity and the reduction of fluctuations in the magnetic field. Cleaning and drying technologies for the cleaning of wafers, quartz tubes, and tools.

Press welding heads (titanium, molybdenum, copper, ceramics, etc.), semi-automatic hot press, fully automatic hot press, pulse system modules, platform fixtures, semiconductor equipment and other related products.

Ion etching cleaning tools, plasma equipment

Lapping, polishing, thinning and CMP equipment.

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.