Beijing TSD Semiconductor Equipment Co., Ltd. takes the mission of "Technology and Services assist customers to Develop", focuses on R&D, production and sales of high-quality surface processing equipment in the semiconductor industry. With more flat, thinner and faster technology orientation, the company focuses on compound semiconductor substrate materials, semiconductor devices, advanced packaging, MEMS and other fields, provides systemic solutions and process equipment for grinding, polishing, and CMP.
Leading innovation, boosting intelligent manufacturing, TSD takes technological innovation as the driving force for sustainable development, insists on independent innovation oriented by customer needs, and provides equipment solutions with superior performance, high production efficiency and cost-effectiveness for customers and the market, brings unlimited possibilities to the industry.
Semiautomatic Single-axis Grinding Machine
Semiautomatic single-axis grinding machine is a high-precision grinding machine with simple operation, abundant function and high cost performance, is equipped with automatic thickness measurement and compensation system in manual loading, can grind wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.
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Semiautomatic Double-axis Grinding Machine
Semiautomatic Double-axis Grinding Machine is a high-precision grinding machine which is equipped with two grinding wheel shafts, has the function of automatic thickness measurement and compensation system, manual loading, moving to fine grinding position after rough grinding, grinding wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.
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Full Automatic Grinding Machine
The full automatic grinding machine is a high-precision grinding machine equipped with fully automatic loading and unloading system, uses wafer manipulator to pick up the wafers, has automatic centering, cleaning and drying functions. It can realize automatic grinding process from cassette to cassette, and keep wafers dry in and out.
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Horizontal Grinding Machine
The horizontal grinding machine is a small, high-precision grinding machine with high cost performance in manual loading, the grinding wheel shaft is installed in a horizontal way, the wafers are manually loaded, and the removal of grinding is controlled by grinding wheel feed. The operating table can be customized according to customer requirements and has a wide range of applications.
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TSP-380
This machine is an easy-to-operate desktop single side polishing machine. It can be matched with copper plate, tin plate, glass plate, stainless steel plate, etc., and with different types of polishing slurry, suitable for lapping and polishing various semiconductor materials, and meet the needs of R&D and small batch production of research institutes & enterprises.
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TSP-400/450
These series machines are floor-standing high-precision single side polishing machines. It can be matched with copper plate, tin plate, glass plate, stainless steel plate, etc., and with different types of polishing slurry, suitable for high-precision polishing of various semiconductor materials.
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TSP-810/910/1270
These series machines are high-precision, four-axis and single side polishing machines. It can be equipped with copper plate, tin plate, stainless steel plate, etc., suitable for high-precision polishing of various semiconductor materials to meet the needs of large-scale industrialization.
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TAP-400/600
These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish one or multiple wafers and meet the high-precision polishing requirements of various materials.
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POLI-400L
POLI-400L is small size chemical mechanical polishing machine for 4&6 inch, which adopts manual loading method, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, are used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
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POLI-500
POLI-500 is a small 8 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
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POLI-762
POLI-762 is a small 12 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
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Solid Wax Bonding Machine
This machine is a high-precision desktop wax bonding machine in manual waxing and placing, with heating and cooling function, automatic pressing, uniform wax layer. The vacuum waxing function can be upgraded, vacuuming first, hot pressing and cooling, the waxing effect is better.
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Liquid Wax Bonding Machine
This machine is a semiautomatic liquid wax bonding machine in manual loading, dripping wax, spinning wax, baking and bonding automatically, silicone airbag pressing wafer, good waxing effect and high precision. It is suitable for wax bonding of various semiconductor substrate materials before polishing.
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Wafer Cleaning Machine
This machine is a fully-automatic wafer cleaning machine, automatically operated by a manipulator in a closed environment, has cleaning and drying functions, suitable for cleaning of various semiconductor substrate materials after polishing, and can effectively reduce particle contamination on the wafer surface.
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Post-CMP Cleaning Machine
These series machines are special cleaning machines after wafer CMP. They have different structures such as single station type, index type, and in-line type, can be used in different applications, the in-line type machine is equipped with fully- automatic loading and unloading system. These series machines are equipped with rinsing, double-side brushing, megasonic cleaning, N2 drying, high-speed spin-drying functions, high integration, small foot space, wet in and dry out, suitable for cleaning all kinds of wafers after CMP.
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