Bonding Equipment

Assembly Automation Technology - dedicated to pick&place, test, inspection and tape&reel processes

Ultrasonic wire bonder, ultrasonic metal welding machine, ultrasonic plastic welder, ultrasonic cleaner, ultrasonic measuring instrument

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH

Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

Surface processing equipment for the semiconductor industry. Wafer Grinding, Polishing, CMP, Bonding/Cleaning/Brishing Equipment

OLED Display Manufacturing Equipment, Thin-Film Photovoltaic Cell Manufacturing Equipment, Vacuum Process Equipment

Semiconductor vacuum equipment and parts. Alignment, Bonding, Annealing, LC Filling, Vacuum Sealing Equipment. Glove box/ Gas purification equipment. Fluxless reflow equipment/ Reduction bonding equipment.

Dispenser, Vision Dispenser, Cabinet Vision Dispenser, Piezo Jet Valve, Wafer Reinforcement, ASIC Encapsulation, Solder Paste, Wafer Underfill, Smart Production Line, Micro Spot Soldering, Soldering Machine

Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

Vacuum plasma equipment, Physical and thermal equipment,

Vacuum equipment, dry vacuum pumps and vacuum instruments and parts

Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.

Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,

Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Die Attach and Dispensing equipment

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.