Die Bonder

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH

Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment

Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.

Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,

Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Die Attach and Dispensing equipment

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

Display and semiconductor equipment.

Manual and semi-automatic die bonders and pick-and-place systems.

Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Total solution provider of die bonding in discrete power devices. Snap oven, clip die bonder, power module assembly line.

Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.

Die bonders, litium ion battery production machine, capacitor aging test machine.