Suzhou Bopai Semiconductor Technology Co., Ltd
, CN Manufacturer
AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems
PROTEC CO., LTD
, KR Manufacturer
Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH
Seen BnTek Co., Ltd.
, KR Manufacturer
Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment
Capcon Limited Co., Ltd
, HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder
Eco-Tech Microelectronics Ltd
, RU Manufacturer, Custom Manufacturer
Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.
JSC NIITOP
, RU Manufacturer
Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,
Hana Mechatronics Co. Ltd/ Hanameca
, KR Manufacturer
Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.
Top-A Technology Co., Ltd.
, KR Manufacturer
Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.
MicroAssembly Technologies, Ltd/ MAT
, US Manufacturer
Die Attach and Dispensing equipment
Palomar Technologies, Inc
, US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.
ficonTEC Service GmbH
, DE Manufacturer, Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).
Solution Advanced Technology Co.,Ltd.
, KR Manufacturer
Display and semiconductor equipment.
DR. TRESKY AG
, CH Manufacturer
Manual and semi-automatic die bonders and pick-and-place systems.
Athlete FA Corporation
, JP Manufacturer
Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System
All Ring Tech Co Ltd.
, TW Manufacturer
Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.
3S Silicon Tech Inc
, TW Manufacturer
Total solution provider of die bonding in discrete power devices. Snap oven, clip die bonder, power module assembly line.
Kaijo Corporation, Kaijo
, JP Manufacturer
Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.
Shibuya Corporation
, JP Manufacturer
Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.
Shibaura Mechatronics Corp.
, JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.
SHENZHEN XINYICHANG TECHNOLOGY CO LTD, HOSON
, CN Manufacturer
Die bonders, litium ion battery production machine, capacitor aging test machine.