Suzhou Bopai Semiconductor Technology Co., Ltd

 , CN Manufacturer
AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems


 , KR Manufacturer
Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH

Seen BnTek Co., Ltd.

 , KR Manufacturer
Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment

Capcon Limited Co., Ltd

 , HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

Eco-Tech Microelectronics Ltd

 , RU Manufacturer,  Custom Manufacturer
Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.


 , RU Manufacturer
Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,

Hana Mechatronics Co. Ltd/ Hanameca

 , KR Manufacturer
Production equipment and automation equipment for semiconductors, crystals, LCDs, FILMs, and optical parts.

Top-A Technology Co., Ltd.

 , KR Manufacturer
Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

MicroAssembly Technologies, Ltd/ MAT

 , US Manufacturer
Die Attach and Dispensing equipment

Palomar Technologies, Inc

 , US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

ficonTEC Service GmbH

 , DE Manufacturer,  Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

Solution Advanced Technology Co.,Ltd.

 , KR Manufacturer
Display and semiconductor equipment.


 , CH Manufacturer
Manual and semi-automatic die bonders and pick-and-place systems.

Athlete FA Corporation

 , JP Manufacturer
Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

All Ring Tech Co Ltd.

 , TW Manufacturer
Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

3S Silicon Tech Inc

 , TW Manufacturer
Total solution provider of die bonding in discrete power devices. Snap oven, clip die bonder, power module assembly line.

Kaijo Corporation, Kaijo

 , JP Manufacturer
Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.

Shibuya Corporation

 , JP Manufacturer
Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Shibaura Mechatronics Corp.

 , JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.


 , CN Manufacturer
Die bonders, litium ion battery production machine, capacitor aging test machine.