KAIJO’s two core competences, "Wire Bonding - High Density Mounting Technology" for assembling and packaging field and "leaning - Precise Cleaning" for various cleaning field.
Bonding Equipment
Ultrasonic is vibration wave (sound wave) with a high frequency that cannot be heard by the human ear, and is used in various fields.
Kaijo's bonder does not use adhesive materials, but utilize the bonding principle (Ultrasonic, Heat, and Load) to connect electrodes on integrated circuits and semiconductor packages with metal wires.
Semiconductors used everywhere in our daily lives are applied to Automobiles, LEDs, 5G communications, IoT, AI, Sensors, etc., and with the development of various technologies, miniaturization and higher performance are progressing day by day. The field of semiconductor assembly equipment has a mission to meet a variety of sophisticated needs such as High speed, High accuracy, Information visualization, Predictive maintenance, and Labor saving and so on. Technological innovation is always required.
Kaijo proposes optimal solutions by making full use of transfer technology, temperature control, and image recognition that are suitable for packages of various shapes and sizes in addition to the bonding technology.
Bonding Equipment
The bonding machine has latest technology to meet the diverse needs of high speed, fine pitch, high-mix low-volume production, and stability in the semiconductor assembly process.
Kaijo's wire bonders are equipped with a variety of transport structures and high-precision bonding technology to support a wide range of products achieving high productivity.
Die bonders that contribute the assembling process of mounting silicon chips on boards or lead frames combine an unique structure and compactness.
We trust that you will be satisfied with the transportation systems and bonding technologies suitable for the specifications of customer's products and packages.
If you have any questions regarding the selection of the most suitable equipment for you, please feel free to contact us.
Bonder list
Thermosonic Ball Bonder (Au, Cu, Ag)
FB-e18
FB-e18
FB-988
FB-988
FB-996
FB-996
Epoxy Die Bonder / Eutectic Die Bonder
DBX-1000
DBX-1000
eDB-2000
eDB-2000
Wafer Level Bonder (Stud Bump)
DBX-1000
FB-996BUMP I
fb-996bump1
FB-996BUMP II &WHS-996
Ball Bonder for LASER (Rotatable Bonding stage)
DBX-1000
FB-e18LDW
eDB-2000
FB-e18LDWⅡ
