Semiconductor Equipment

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

EUV HVM Reflectometer, EUV Accelerated Exposure Tool, Actinic Image Review System (AIRES®), EUV Pellicle Transmission Measurement System, EUV Pellicle High-Speed Mapping Tool, EUV N&K and Phase Measurement Tool, EUV Resist Outgassing Tool

Semiconductor and FPD Equip: Non-Pattern Surface Inspection System (WM series), Pattern Inspection System (Vi series), Bump Height Inspection System, TSV / Trench Depth Measurement System, Proximity Exposure System (TME series), Visual Inspection System.

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Multilayer Ceramics Equipment: Roller Benches, Tape Casters, Sheet Blankers, Punching Machine, Screen Printers/Tunnel Dryers, Print AOI, Stacking Machines, Screen Printer- Stacker Laminators, Green Cutters, Metallization, SMD Component Inspection.

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

Single wafer processor, Wafer scrubber, hybrid wafer cleaner system

Mask/LED/LCD/OLED Laser Repair. Atmospheric SEM, AVI (Auto Visual Inspection) for OLED, TFT AOI

Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH

Interface Control Technology Module & Parts: N2 Purge Load Port System, N2 FOUP Purge System. PECVD & PCVD Module & Parts: Cassette Loader, Wafer Transfer Module, RPCVD Installation

Plasma Technology, Electromagnetic Shield Technology, Gas Purification Technology, Automation System Technology, Precise Alignment Technology in Vacuum

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

SREM Scanning Reflection EUV Microscope, Ephase EUV mask phase measurement system, EUVPTR EUV pellicle transmission and reflectance measurement system, EMiLE EUV Micro-interference Lithography Equipment

Technologies for ALD, CVD, ETCHER, and CLEANING semiconductor equipment using Helicon plasma.

OLED INSPECTION EQUIPMENT, LCD INSPECTION EQUIPMENT, WAFER LASER SAW, Probe (MEMS film type) OLED/LCD Probe Unit (MEMS film Type), Probe (Blade Type) OLED/LCD Probe Unit (Blade Type)

POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

Semiconductor cleaning equipment