Assembly & Packaging Equipment

Die Bonder | Wire Bonder | Scriber | Laser tester/stacker | Rework station | Inspection Camera |

Manufacturing machines for: Power device, Semiconductor, Electronic Components, Flat Panel Display, Plastics, Automotive, Medical appliance and other peripheral equipment, devices, and machines. Design, Maintenance, Instalment, and Sales

Assembly Automation Technology - dedicated to pick&place, test, inspection and tape&reel processes

Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment ​

Thick Film and SMD (Surface Mounting Device), IMS, screen-printing on stainless steel technology, ensuring a full-service custom design.

Semiconductor Equipment Solutions. Wet Bench Process Equipment, Single Wafer Wet Process Equipment, FOUP cleaner

Steam two-fluid cleaning systems, highly concentrated ozone water cleaning equipment.

UV irradiator, Wafer Laminator, Tape Mounter, Plasma Cleaner. Semiconductor Factory Automation: OHT, Stocker, Bonding Automation. Precision machined equipment parts.

Ultrasonic wire bonder, ultrasonic metal welding machine, ultrasonic plastic welder, ultrasonic cleaner, ultrasonic measuring instrument

Wafer Vision / Handler, Strip Level Inspection, Tape & Reel Vision / Handler

Laser Solution, Plasma Technology , FPC Equipment, Tape and Reel

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Semiconductor packaging equipment manufacturer. - DISPENSER -DIE BONDER - DIE ATTACH

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

OLED INSPECTION EQUIPMENT, LCD INSPECTION EQUIPMENT, WAFER LASER SAW, Probe (MEMS film type) OLED/LCD Probe Unit (MEMS film Type), Probe (Blade Type) OLED/LCD Probe Unit (Blade Type)

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment