Daesung Engineering, a leading global company in semiconductor facilities and automation that provides the best value to
customers, is growing beyond small and medium-sized companies based on differentiated products, continuous new
technology development, facility investment, and thorough environmental safety management. We also practice a strong
organizational culture that acts steadily for the development of executives and employees, companies, and communities.
1. DSUV-128(UV Iradiation)
Equipment that removes the adhesice force of the tape after Wafer cutting(SAWING) in the semiconductor package process
to facilitate separation between the device and the protective tape during the next process, DIE attachment. The light source
can be LED or mercury lamp.
Option
- OHT
- 2 Loadubg Port
