Dicing Equipment

UV irradiator, Wafer Laminator, Tape Mounter, Plasma Cleaner. Semiconductor Factory Automation: OHT, Stocker, Bonding Automation. Precision machined equipment parts.

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

OLED INSPECTION EQUIPMENT, LCD INSPECTION EQUIPMENT, WAFER LASER SAW, Probe (MEMS film type) OLED/LCD Probe Unit (MEMS film Type), Probe (Blade Type) OLED/LCD Probe Unit (Blade Type)

Laser processing equipment for semiconductor, display, PCB

Sputtering System, OLED System, Solar Module System, AMHS, AS/RS, 3D Printer, Converting Machine

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

Hermes CO2 Bubbler, AOI, Metis Magic Water, ESD Nozzle, AGV

Laser marking, dicing and scribing equipment for wafers, wafer thickness measurement equipment, substrate defect detection machine

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Wet Cleaning Systems and Chemicals, UV Ozone Cleaner, Wafer Mounter, Wafer Expander, Grip Ring, UV Curing System

Automatic Wafer Loader, Automatic, Semiauto and Manual Wafer Mounter, Automatic and Manual Wafer ID and Frame ID Reader and Automatic Wafer Packer / Unpacker / Sorter

Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,

Wet process stations, Resist processing equipment, Dicing equipment, PCB processing equipment

Precision dicing saws and machining systems for Semiconductors, Photonics, MEMS, PZT & Piezo materials, special materials and related industries

Dicing saws, Ball, Bump, Burr AOI

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.