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Scriber

A scriber is a tool used in the assembly and packaging of electronic components, including wafers, to make a line on the surface for breaking or cutting. It typically consists of a sharp-pointed metal rod or needle mounted on a handle and is used to mark a line on the surface of a material before it is broken along the marked line. There are various types of scriber tools, including mechanical scriber, diamond scriber, and laser scriber, each with different applications and advantages. Scribe and break is a process used in the semiconductor industry for singulating wafers into individual dies. In this process, a scribing tool (such as a diamond scribe) is used to make a line on the wafer along the desired cut line. Then, the wafer is broken along the scribe line into individual dies. This is a cost-effective way to separate the wafer into individual dies compared to other methods like laser cutting. Scribing can also be done on other materials like glass, ceramics, and crystals. The method is used in various applications such as the production of photovoltaic panels, LCD displays, and others. The scribe and break technology process has some disadvantages including: Low yield: The process of breaking the wafer into individual chips can result in significant wafer breakage, reducing the overall yield. Substrate damage: The scribing process can cause mechanical damage to the substrate that affects the electrical and mechanical properties of the individual chips. Labor intensive: The process is manual, requiring skilled operators to perform the scribing and breaking operations. Cost: The process can be expensive, due to the cost of the scribing equipment, the labor required to perform the process, and the reduced yield. Time-consuming: The scribing and breaking process is time-consuming, adding to the total time required to produce a finished product.

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AVACO Co Ltd

, KR Manufacturer

Sputtering System, OLED System, Solar Module System, AMHS, AS/RS, 3D Printer, Converting Machine

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DAINICHI SHOJI K.K.

, JP Manufacturer

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

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PRO Win Co Ltd.

, KR Manufacturer

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

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NeonTech Co Ltd

, KR Manufacturer

Dicing saw, MLCC cutter, sapphire wafer breaker for LED chip separation, tape mounting system, wafer wet spin cleaner,

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Lattice Gear, LLC

, US Manufacturer

Cleaving & Scribing Tool, LatticeAx, Flipscribe Systems, Glass & Sapphire Cleaving

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