At Loadpoint we have been designing and manufacturing dicing saws and precision micro-machining equipment for over 40 years. We have many machines in operation on sites around the globe and work actively with a network of international agents. We have an enviable reputation for building very reliable high specification machines that are genuinely built to last. We regularly service machines that have been at work in a production environment for over 30 years.

Loadpoint works with clients to ensure the final machine specification is totally suitable for their application. We are able to customise and adapt the machine control software to specifically satisfy our customer’s requirements. Our well-equipped demonstration area also undertakes dicing solutions for companies who don’t have the volume of work to justify their own machines or are in the process of building up volume. We employ our own service engineers so you can be assured your machines will get the best of care in the future. Our technical support team is available to help with any advice you may need and with the online diagnostics system built into all our new machines, we can even go so far as to design and download production programmes directly to your machine. Loadpoint are proud to be the only manufacturer of dicing systems in Europe.

Dicing Machines
What are your requirements?

160mm/(6 inch) Cutting (up to 15mm thick)
200mm/(8 inch) Cutting (up to 15mm thick)
300mm/(12 inch) Cutting (up to 15mm thick)
Heavy Duty Cutting (up to 60mm thick)
Automatic Cleaning/Washing Station
Wafer Mounting
MICROACE 66
MicroAce 66
The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle set-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.

Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.

Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)    152mm x 152mm x 16mm
Blade Capacity    50.8mm – 76.2mm, (101.6mm option available)
Chuck-type    Ceramic or metal vacuum
Spindle Options    1.8kW, 3,000 – 60,000rpm as standard, or 3.0kW 3,000 – 10,000 rpm
Dimensions (W x D x H)    570mm x 1215mm x 1555mm
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NANOACE 3200
NanoAce 3200
The NanoAce 3200 is an 8” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)    200mm x 200mm x 13mm
Blade Capacity    50.8mm – 101.5mm
Chuck-type    Ceramic or metal vacuum chuck
Spindle Options    1.8kW, 3,000 – 60,000rpm
Dimensions (W x D x H)    1046mm x 1030mm x 2048mm (height includes traffic light)
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NANOACE 3300
NanoAce 3300
The NanoAce 3300 is a 12” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)    300mm x 300mm x 13mm
Blade Capacity    50.8mm – 101.6mm
Chuck-type    Ceramic or metal vacuum
Spindle Options    1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm
Dimensions (W x D x H)    1046mm x 1030mm x 2048mm (height includes traffic light)
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MACROACE II
MacroAce II
MacroAce II for heavier duty applications requiring high power spindle delivery and large work areas.
The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic & metal cutting applications. Additionally, cut depths of up to 55mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader.

The MacroAce II is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays.

The performance of the MacroAce II is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Max. Work Capacity (X, Y, Z)    Rotational Capacity, 305mm x 305mm x 55mm
Blade Capacity    100mm - 200mm (*55mm cut depth with 200mm dia. blade)
Chuck-type    Ceramic or metal vacuum, mechanical vice, magnetic vice
Spindle Options    3kW, 1,000 – 10,000rpm
Dimensions (W x D x H)    1440mm x 1400mm x 2350mm (height includes traffic light)
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MACROACE II VS
MacroAce II VS
The MacroAce II VS is a vertical spindle drilling system that can be used for core drilling, micro drilling and milling of a variety of substrates. The MacroAce II VS utilises an air bearing spindle to provide the best performance in regard to accuracy and quality of cut. Full automatic program control is achieved via Loadpoint’s own Nanocontrol System. Alternatively, for users who prefer a more CNC style interface, the MacroAce II VS can be fitted with control system.

With a positioning resolution of 0.001mm, even the most challenging specifications are achieved.

The MacroAce II VS has the flexibility for prototype trials and small batch runs but also has full functionality for high volume production work.

Max. Work Capacity (X, Y, Z)    305 x 305 x 55mm, or with auto tool change 250 x 250 x 55mm
Tooling    0.1mm - 50mm
Spindle Options    3kw, 1,000 - 10,000 rev per min
Dimensions (W x D x H)    1440mm x 1400mm x 2350mm (height includes traffic light)
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WASHPOINT
Washpoint
Introduce consistent quality of output following post-dicing / photoresist processes. Improve production line productivity.

The Washpoint is a self-contained, fully integrated free standing washing station for cleaning and drying wafers, substrates or plates up to 300mm in diameter following dicing, scribing or other machining processes.

A flexible washing process allows all elements of the cleaning and drying sequence; cycle time, water pressure, gas pressure and dry heat output to be easily adjusted to meet individual process demands. The compact footprint ensures you get the most out of your available floor space.

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PRESSPOINT
Presspoint
Presspoint – Tape Ring Applicator

A low cost solution for tape ring / hoop ring preparation and mounting. Can also be used as a simple die expander.

The Loadpoint Presspoint is one of the most versatile and efficient manual closing and post dicing stretch systems available. It requires no power and is usable straight from the box.

Dicing Solutions
LOADPOINT’S DICING SOLUTIONS FACILITY FOR DICING, CUTTING, DRILLING, GRINDING & PROTOTYPING.
Loadpoint operate an in-house production facility that is used by customers who prefer to outsource their material processing needs. We process materials from a wide range of industries including automotive, medical, aerospace, space industry, electronics / semiconductors as well as for many academic and research-based institutions.

Their reasons for sending us their materials are varied but include the following objectives:

Achievement of high cut quality
Cost / productivity savings
Extra production capacity to meet demand
Pre-production trials
Prototyping of new products
Projects to determine a better dicing process
OUR CAPABILITIES INCLUDE:
Up to 12inch capability.
Loadpoint operate several 6”, 12”and heavy duty dicing saws.
Cut depths from 0.010mm to 55mm
Core drilling and large diameter glass disc production
Resin potting / backfilling for sonar arrays
Post-dicing cleaning (spray and ultrasonic)
3-axis optical measurement
Loadpoint’s philosophy is to be flexible to customer needs, if you have a new or specialist project please contact us and we can discuss how Loadpoint could help with your requirement.

MATERIALS / JOBS PROCESSED:
Glass plates with / without chrome masks
Silicon wafers
Carbon graphite block and plate
PZT arrays – sonar, ultrasound
Optical components / photonics
Ceramics – plate, rods and profiles
Speciality and high value metals for the electronics industry, e.g. Molybdenum & Iridium
Electronic component singulation / FR4 boards
MEMs structures
WORK HOLDING AND PACKAGING AVAILABILITY
Dicing Tapes
Standard dicing tape: low, medium and high tack blue tape
UV Tapes: standard UV wafer tape. Package / singulation strength thick tape
Green tape – for adding additional thickness to standard dicing tapes
Wax
Water and solvent based
Mounting Plates
Graphite, glass and stainless steel
Chucks
Ceramic vacuum chucks, metal vacuum chucks, mechanical chucks, magnetic chucks, tapeless chucks. We also have the in-house capability to design and manufacture bespoke chucks to suit customer requirements

Dicing Blades
Blades supplied by Loadpoint are available in a variety of dimensions, bond types and grit sizes. A selection of our main products available is given below.

Please contact us with details of your application if you require a recommendation on a blade or a specific blade type for your process.

Fast delivery on stocked blades, and expedited services potentially available for longer lead time blades with a wide range to suit most dicing and cutting applications.


Resin bonded, hubless
ODs (mm) = 50-127
Widths (mm) = 0.070-2.00
Ceramics, glass, hard materials requiring high wear characteristics

1000 Series - Resin Bonded, hubless
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Electroformed, hubless
ODs (mm) = 50-140
Widths (mm) = 0.025-0.3
Silicon, GaAs, softer ceramics (e.g. PZT), various semiconductor packages. Applications for easier to cut materials requiring long blade life

1200 Series – Electroformed, hubless
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Metal bonded, hubless
ODs (mm) = 50-76.2
Widths (mm) = 0.050-0.70
QFN, BGA, FR4/PCB, resin boards, composite materials, polymers and softer ceramics

1400 Series – Metal Bonded, hubless
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Electroformed, hubbed
ODs (mm) = 55
Widths (mm) = 0.015-0.100 Various protrusions
Si, GaAs, SiGe, III-V, semiconductors

1900 Series – Electroformed, hubbed

Resin or metal bond on steel core
ODs (mm) = 76.2-180
Widths (mm) = 0.4-1.20
Large capacity cutting and dicing such as ceramics and metals

2000 Series – Resin or Metal Bond on Steel Core

Vitrified blade
ODs (mm) = 50-125
Widths (mm) = 0.07-0.6
Sapphire, crystal, SiC, Si3N4, etc

2100 Series – Vitrified Blade
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Grinding wheels, resin bond
ODs (mm) = 76.2-100
Widths (mm) = 1.0-6.0
Grinding of a variety of substrates to achieve thickness tolerance or for grinding of PZT composites

2500 Series – Grinding Wheel, Resin Bond

Resin bond core drills
ODs (mm) = 6-60 Ø
Widths (mm) = 0.5-2.0 wall thickness
PZT discs, glass encoder discs, power semiconductors. Single or dual wall

3000 Series – Resin Bonded Core Drills

 

Dicing Spares/Consumables

CHUCKS
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Chucks

DICING AND BACKGRINDING TAPES
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Dicing and Backgrinding Tapes

MOUNTING HANDLING/BLADE DRESSING
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Mounting Handling/Blade Dressing

DICING BLADE TOOLS
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Dicing Blade Tools

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