Assembly Materials

Semiconductor Leadframe, Leadframe, Connector Mold, Semiconductor Post Process Mold, Injection Mold Press Business Unit, Injection Business Unit

Engineering Services, Cost effective Solution

Electronic Products (EPI) manufactures high-quality hermetic electronic packaging using advanced glass-to-metal and ceramic-to-metal sealing technologies, tailored for harsh environments and critical applications.

Industrial Superhard Tools

Robson Technologies, Inc. (RTI) engineers custom hardware test interfaces—test sockets, PCB fixtures, and automated curve tracing DC parametric test equipment. We collaborate with you, providing tailored solutions to your unique test requirements.

Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment ​

Pre-molded Lead Frame Package (Air Cavity Package) and Lid Cover

Copper clad laminates

IMS and HTC materials, IC Substrate Materials, Flexible Materials, HSD Materials

Tools for semiconductor assembly: DIE BONDING TOOL, WIRE BONDING, DISPENSING, BACK END, PRECISION TOOL, ACCESSORY, FLIP CHIP, TAPE & REEL

Wafer Vision / Handler, Strip Level Inspection, Tape & Reel Vision / Handler

DNS is a world leading manufacturing of Suction Cup and Suction Tip for pick and place technology equipment and machinery. Customize Suction Cup, Suction Tip on Shape, Material and ESD.

Precision ceramic parts, porous vacuum chuck, die bonding tools, CNC machining parts, and customized tools

Hermetic packages, glass-to-metal seals

Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

Open Cavity QFN package and lids, test sockets, bonding wire

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC