Assembly Materials

Hermetic packages, glass-to-metal seals

Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

Open Cavity QFN package and lids, test sockets, bonding wire

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

Multilayer Ceramics Equipment: Roller Benches, Tape Casters, Sheet Blankers, Punching Machine, Screen Printers/Tunnel Dryers, Print AOI, Stacking Machines, Screen Printer- Stacker Laminators, Green Cutters, Metallization, SMD Component Inspection.

OLED INSPECTION EQUIPMENT, LCD INSPECTION EQUIPMENT, WAFER LASER SAW, Probe (MEMS film type) OLED/LCD Probe Unit (MEMS film Type), Probe (Blade Type) OLED/LCD Probe Unit (Blade Type)

CHILLER, HEAT EXCHANGER, SCRUBBER, TEST CHAMBER. RETAINER RINGS and OTHER PROCESSING PARTS

Burn-in Testers and Burn-in Boards

SSD Module, PCB Memory Module, PCB Multi-layer Module. Semiconductor Package Substrate

Materials for semiconductor manufacturing process: polymer (Resin), photoresist (PAG), and additives, and materials such as Resin for SOC, Resin for BARC, and Acid Generators. Coating materials

Sputtering Targets, Gilding Materials, Conductive Pastes.

Semiconductor products: photoresists (PR), bottom anti-reflective coatings (BARC), spin-on-carbon (SOC), CMP slurries, wet chemicals, colored resist, organic insulating layer materials.

Stamped lead frames, electrical connectors, contacts and various other electrical and non-electrical component parts.

High quality, custom designs, from production test, burn in custom cards to DVT ( Design, Verification Testing)

Contact Probes, Probe Cards, Special Contacts

Probe Cards. WAFER PROBING TEST: Vertical Cantilever, Epoxy Cantilever, MEMS Cantilever. PACKAGE PROBING TEST: PCB Test Jig/Fixture, DDIC Package Test