Die Attach

Tools for semiconductor assembly: DIE BONDING TOOL, WIRE BONDING, DISPENSING, BACK END, PRECISION TOOL, ACCESSORY, FLIP CHIP, TAPE & REEL

DNS is a world leading manufacturing of Suction Cup and Suction Tip for pick and place technology equipment and machinery. Customize Suction Cup, Suction Tip on Shape, Material and ESD.

Precision ceramic parts, porous vacuum chuck, die bonding tools, CNC machining parts, and customized tools

Thin-Film Substrates, Ceramics Products, Precision Products, Diamond Products, Contract Manufacturing Services

Packaging and bonding materials in the semiconductor and electronics field.

Special polymer materials for electronics

Wire saw cutting auxiliary materials- adhesives, coolants, beams.

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

Conductive Die Attach, Non Conductive Polymer, Flux, Solder Balls

Electronic insulating films, electronic one component epoxy adhesives. Functional chemicals

Electronic Adhesives, Inks, Pastes and Coatings

Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

Bonding Capillaries, Die Bonding, Flip Chip Handling, Wedge Bonding, Single Point-TAB Bonding Tools

Resins, adhesives and inks for the electronics industry

Advanced siloxane-based formulations and resin systems for Optical Devices, Opto Packaging and Printed Electronics.

Adhesives, potting and encapsulation products for semiconductors and electronics.

Semiconductor silicone and epoxy product sealants

Dispensing Tools, Stamping Pin, Pick Up Tool, Die Collet, Jet Nozzle, Die Bonding Tools, Epoxy Stamping Tools, Ejection Needle, Micro Tube, Module Ferrule and Metal Tube

Die attach adhesives and films (DAF), EMI absorber

Die attach adhesives for solar, LED, semiconductor.