Epoxies

Packaging and bonding materials in the semiconductor and electronics field.

Electronic insulating films, electronic one component epoxy adhesives. Functional chemicals

Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

Resins, adhesives and inks for the electronics industry

Semiconductor silicone and epoxy product sealants

Die attach adhesives and films (DAF), EMI absorber

Die attach adhesives for solar, LED, semiconductor.

Die attach adhesives, photoresists, conductive inks, encapsulants.

Epoxy molding compounds, die attach adhesives, DBC and AMB ceramic substrates, metallized ceramics.

Die attach adhesive. Nano silver powder and pastes.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy die attach adhesives. Epoxy systems for coating, encapsulation, potting and bonding.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy adhesives for die attach, encapsulation and optical applications.

Die attach materials, adhesives for semiconductor and electronics industry. EMI shielding pastes and coatings.

Backgrinding and dicing tapes, DAF die attach films, polarizing films, encapsulation compounds, OLED materials.

Dicing, backgrinding and DAF die attach fil,s. Encapsulation materials for packaging. Coatings. Dia attach materials.

Backgrinding, DAF die attach films, surface protection films, molding compounds.

Backgrinding, dicing and die attach films. Underfil and glob-top encapsulation materials. Thermal interface materials.