Nitto provides a wide range of products for manufacturing processes and parts, including semiconductor and electronic component manufacturing process materials, optical device sealing materials, and HDD peripheral materials.
Beginning with surface protection films, Nitto provides a diverse lineup of products for processing materials such as metal plates, resin substrates, glass sheets, etc
Optical clear adhesive sheet
Low VOC double-coated adhesive tape
Bonding and Jointing Products
Transparent epoxy encapsulating resin Die attach film with pressuresensitive dicing tape
Backgrinding Tape Line-up ELEP HOLDER™
Cleaning Material for Wafer Chuck Table Cleaning Wafer™
Dicing Tape Line-up ELEP HOLDER™
Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT™ (EM Series)
Heat Resistance Back Grinding Tape(Under Development)
Heat-resistant Low Adhesion Sheet PW(PROSS WELL) / TRM Series
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Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series
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Protection Tape Applicator for Backgrinding Process NEL SYSTEM™ Series
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Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series
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Protection Tape Remover for Backgrinding Process NEL SYSTEM™ Series
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UV Irradiator for Dicing Process NEL SYSTEM™ Series
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Vacuum Wafer Mounter NEL SYSTEM™ series
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Wafer Mounter (Full-auto type) NEL SYSTEM™
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Wafer Mounter (Semi-auto type) NEL SYSTEM™
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Wafer Re-Mounter (MA3000III + Frame removal unit) NEL SYSTEM™ series
Clear molding compound for optical semiconductor NITORON T(NT) Series
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Thermal Release Tape For Hard Substrate NWS-TS322F
Solvent Resistance Dicing Tape(Under Development)
Nitto SWT 20+R dicing tape
Semiconductor Wafer Processing Tape SWT 20+R
Thickness(mm) 0.075
Adhesive strength(N) 1.0
Carrier type PVC
Nitto SWT 10T+R dicing tape
Semiconductor Wafer Processing Tape SWT 10T+R
Thickness(mm) 0.128
Adhesive strength(N) 1.2
Carrier type PVC
