Optical polishing services, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing services, back grinding, flat lapping and CNC machining of all hard materials including Ceramic substrates, Quartz, Aluminum Nitride (AlN), Optical Glass, Sapphire windows, Silicon wafers and very thin lapped glass or optically polished substrates and windows.

Annealing, backgrinding, bonded wafer thinning, chamfering, CMP polishing, coating, cryogenic stress relieving, custom CNC machining, cutting, dicing, drilling, edge and angle optical polishing, hole drilling, individual die and module thinning, lapping, lasering, O.D. grinding, O.D. polishing, optical polishing , oxide layer polishing, precision lapping, precision polishing,sawing, shaping, singulating, slicing, superpolishing, thinning, ultra-sonic drilling, ultra-thin optical polishing and dicing, wafering, waveguide facet polishing .

lapping polishing dicingcnc machined aluminumcustom opticsshims and spacerscnc machined glassshims and spacersmetal components lapped and polishedfused silica quartz machiningpolished waferswashers and discsalumina waferssilicon waferscnc machined glass and ceramicStainless steel wafersaluminum nitride substratescnc machined metals 
Fused silica wafers, fused silica substrates, fused silica windows, optical glass, optical glass windows, glass wafers, glass substrates, flat optics, glass rods, glass spacers, witness samples, sapphire optical windows, SEMI standard dummy wafers up to 450mm diameter, flat optical components, waveguides, beam splitters, polarizers, flat glass lenses, glass filters, glass prisms, wafer chucks, vacuum chucks, stainless steel wafers, metal optics, copper optical mirrors, polished molybdenum mirrors, brass mirrors, nickel mirrors, photonic devices, optical components, substrates for MEMS and Nano-optical devices, capacitors, ceramic substrates, ceramic and glass precision shims and spacers, fused silica solar cells, thinfilm circuits, sensors, ultra-thin germanium wafers, ultra-thin fused silica substrates.

NEW! 5 Axis CNC Micromachining, and Polishing of HVOF WC-Co Slab Gate Valves

1737 Glass, 7070 Glass, 96% Alumina, 99.6% Alumina, AF45, AlON, Aluminum, Aluminum Nitride, B270, Barium Fluoride, BK7, Brass, Cadmium Telluride, Carbide, Ceramics, Composites, Copper, Cordierite, Crystals, D263 Glass, Eagle Glass, Ferrites, Filter Glasses, Fused Silica, Fused Quartz, Gallium Arsenide, Garnet, Germanium, Glass, Gorilla Glass, Graphite, InGaAs, Indium Phosphide, Lanthinum Aluminate, Lithium Fluoride, Luag, Macor, Magnets, Metals, MgO, MgTiO3, Mica, Molybdenum, Nickel, Niobates, Oxides, PEEK, PLZT, PZT, Pyrex, Quartz, Roulon, Sapphire, Silicon Carbide, Silicon, Single Crystal Quartz, Soda Lime Glass, Stainless Steel, Steatite, Teflon, Titanates, Titanium Carbide, Tungsten, Zerodur, Zinc Selenide, Zinc Sulfide, Zirconia, and others.

Patented non-contact Optical Interferometer for measuring flatness of thin, transparent wafers, windows and substrates by interferometric comparison to an optical reference flat. Unlike with Fizeau Interferometer, the need for an application of film on the backside of thin transparent wafers has been eliminated.

•300mm 99.6% Ceramic thin film substrates
•7070 glass for microwave windows
•96% Alumina thick film lapped substrates
•Aluminum Nitride and Alumina Ceramic substrates
•BK7 Schott glass optical properties
•Centerless precision lapping machines by Size Control
•Clear Fused Quartz GE 124, 100mm wafers from stock
•CMP polishing Machines for Silicon Germanium, GaAs, GaP
•Custom dicing of all materials including metals by Valley Design
•Dicing of Silicon wafer stacks by Valley Design
•Dicing wafers, substrates, circuits and optical windows
•Disco wafer and substrate dicing chucks reconditioned
•Dummy wafers simulating Silicon from Valley Design
•Electro-optical material processing press release list
•Electro-Optical materials
•Expert precision lapping, polishing, thinning of wafers
•Flat lapping of large metal vacuum chucks and plates
•Float Zone Silicon
•Fused Silica and Fused Quartz flat optics from Valley Design
•Fused Silica, Fused Quartz wafers, substrates and windows
•Fused Silica, Quartz substrates, and windows
•Lapping, polishing copper, Aluminum and Stainless Steel
•Large Sapphire blank polishing
•Laser hole deburring, chamfering, and blending
•Laser slag removal and substrate chamfering
•List of Trade Shows that Valley Design will be attending
•Long rod polishing - all materials
•Metallic mirrors vs. pure metal mirrors
•Molybdenum metal polished mirrors and optics
•Optical Grade Silicon
•Optical glass disks, flat glass, precision polished glass
•Optical lapping and polishing machines wanted by Valley Design
•Photomasks are now available from Valley Design
•Polished Fused Quartz Substrates from Stock
•Polished glass wafers and substrates to SEMI standards
•Wafering, sawing and cutting of crystals and glass
•Polished optical grade silicon, high resistivity
•Polished optical windows and substrates, also ultra-thin
•Polished Sapphire disks and washers
•Polished Sapphire substrates, ultra-thin, from Valley Design
•Polished Silicon Plates and Wafers
•Polished Stainless Steel Wafers
•Precision dicing, singulating and cutting of all materials
•Precision lapping and polishing machines - Valley Design
•Properties of 1737F Glass
•Properties of 7070 Glass
•Properties of 7740 Pyrex
•Properties of 7980/7940 Fused Silica
•Properties of AF45
•Properties of Borofloat Glass
•Properties of D263
•Properties of Sapphire
•Properties of Soda Lime Glass
•Sapphire substrate, blank and window polishing
•Semiconductor material shaping capabilities up to 300mm
•Silicon Carbide wafers, substrates polished from Valley Design
•Silicon lapping, backlapping and thinning services
•Silicon wafer and die thinning, backlapping and polishing
•Silicon wafers and ingots
•Silicon with neutron transmission doping, NTD
•Stainless Steel Optics
•Stainless Steel Substrates
•Substrate Machining Techniques
•Substrates for thin films from stock
•Superpolished metal optical components
•Telescope light weight reflector
•Thin Ceramics and thin Ceramic substrates and wafers
•Thin film Ceramic substrates of 99.6% Alumina
•Thinning of Silicon and GaAs wafers, substrates and dice
•Ultrasonic Drilling of substrates and windows
•Vacuum chuck repair service from Valley Design
•Wafer carrier plates
•Wafering and Slicing Services
•Wafering, sawing and cutting of Crystals and glass by Valley Design