Ceramic Substrates and Wafers

Innovacera main business is produce metallization ceramics and ceramics components as customer request.

DBC, AMB, DPC, AlON, Al2O3, ZTA, Si3N4, AlN, Solder- and Sintermaterials, OSAT

RF series products, power series products, and high-end heat dissipation materials, and provides high-power packaging and testing services.

Polysilicon, Silicon nitride, Fumed Silica

Polycrystalline Silicon, Metallic Boron, Trichlorosilane, Fumed Silica "REOLOSIL", Tetrachlorosilane, High-purity Aluminum Nitride (AlN) Powder and Granules SHAPAL™ Aluminum nitride ceramics, Boron nitride, Photoresist Developer

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

Thin-Film Substrates, Ceramics Products, Precision Products, Diamond Products, Contract Manufacturing Services

LGT single crystal ingot, Crystal Devices, Precision Measuring Instruments, Thin-film Submount, MEMS, Magnets, Ceramic Parts

Focus on semiconductor and flat panel (TFT-LCD) field Industry's equipment parts and material business. Our main products: TFT-LCD ESC, Semiconductor equipment's Si, QTZ, AL2O3 parts and Y2O3 Coating.

Ceramic precision parts for semiconductors and LCDs from alumina, zirconia, silicon nitride, silicon carbide, quartz.

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

AlN ceramics, Al2O3 ceramics, BeO ceramics and BN ceramics (BN, PBN, HBN)

CVD PBN ceramics, CVD/CVI SiC ceramics and parts

π-Fab - Prototype Fabrication, SiC-Services, Failure Analysis, Trouble Shooting in Power Electronics, Equipment and processes for the production of crystalline bulk and layer materials for electronics, comprising silicon, wide-band-gap semiconductors.

direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

Insulating Substrate Si3N4 for Power Semiconductor Modules, Ceramic Scintillator, Sputtering Target Materials, IC Lead Frame Materials, Lid And Seal Ring, Monodisperse Conductive Ni-P Particles, Lead Pin.